PCB Warpage Simulation via Anisotropic Element Segmentation
Find Innovative SolutionsGenerate Solutions
Solution Overview
Problem
As semiconductor manufacturing technologies advance, the increasing complexity of printed circuit boards leads to warpage issues, causing defects in connections between circuit boards and semiconductor dies, which existing simulation methods either require excessive resources or compromise accuracy.
Innovation Solution
A computer-implemented method and processor-implemented system that divide the printed circuit board layout into elements, calculate anisotropic and isotropic attributes based on material directions, and predict warpage, allowing for accurate simulation with reduced resource usage.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If existing simulation methods are used for complex printed circuit boards, then comprehensive simulation coverage is achieved, but computational resources required increase excessively
Solution Approach 1:
The printed circuit board layout is divided into multiple elements of the same size, creating a grid structure where each element can be independently analyzed. This segmentation allows the simulation to focus computational effort on critical multi-material elements while simplifying single-material regions, thereby reducing overall computational resource requirements while maintaining simulation accuracy.
Solution Approach 2:
Different simulation approaches are applied to different regions of the printed circuit board based on their material composition. Multi-material elements receive detailed anisotropic analysis while single-material elements use simpler isotropic models. This local differentiation optimizes computational resources by applying appropriate simulation complexity only where needed, rather than uniformly across the entire board.
2Measurement precision
If detailed simulation of all elements is performed, then simulation accuracy is improved, but computational complexity increases
Solution Approach 1:
The layout is segmented into elements that are further categorized into multi-material and single-material groups. This segmentation enables the simulation system to apply different levels of analytical complexity to different element types, reducing overall simulation complexity while maintaining accuracy where it matters most - in the multi-material regions that contribute most to warpage.
Solution Approach 2:
The simulation complexity is adjusted by changing the parameter representation: multi-material elements use anisotropic attributes with direction-dependent properties, while single-material elements use simpler isotropic attributes. This parameter differentiation reduces computational complexity by avoiding unnecessary complex calculations in regions where they are not needed, while maintaining precision in critical areas.
Data Source
AI summary
A computer-implemented method for a simulation of a printed circuit board includes dividing a layout of the printed circuit board into elements having the same size, detecting first elements that have at least two materials from the elements, calculating anisotropic attributes of the first elements and assigning the anisotropic attributes to each of the first elements, and calculating a warpage of the printed circuit board based on the anisotropic attributes of the first elements. The anisotropic attributes depend on physical properties according to directions of the first elements on the layout.