Printed Wiring Board Warpage Control via Segmented Core Resin Layers
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Solution Overview
Problem
Existing printed wiring boards with built-in electronic components face challenges in managing thermal expansion differences between core and non-core material layers, leading to warpage and reduced connection reliability.
Innovation Solution
A printed wiring board design featuring a central resin insulating layer without a core material, sandwiched between a first resin insulating layer without a core material and a second resin insulating layer containing a core material, with specific thickness and inorganic particle content ratios to balance thermal expansion coefficients and reduce warpage, while maintaining high connection reliability and integration density.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Strength
If a core material is used in the resin insulating layer, then structural strength and rigidity are improved, but thermal expansion differences cause warpage and reduce connection reliability
Solution Approach 1:
The resin insulating layer is divided into multiple layers with different core material contents. The first resin insulating layer contains a core material while the second resin insulating layer does not contain a core material, creating a segmented structure that balances structural strength and thermal expansion management
Solution Approach 2:
Different regions of the resin insulating layer have different material compositions tailored to local requirements. The first resin insulating layer uses core material for strength where needed, while the second layer uses non-core material for thermal expansion control in other regions
2Manufacturing precision
If core material is used throughout the resin insulating layer, then manufacturing precision is improved, but thermal expansion causes warpage
Solution Approach 1:
The resin insulating layer is segmented into multiple layers with different core material contents. By dividing the single layer into a first layer with core material and a second layer without core material, the patent achieves both manufacturing precision and warpage control
Solution Approach 2:
The patent uses composite material structure where the resin insulating layer combines different material types (core material and non-core material) in a layered configuration, creating a composite structure that balances manufacturing precision and dimensional stability
3Productivity
If the board structure is made thinner for higher integration density, then productivity is improved, but thermal expansion management becomes more difficult
Solution Approach 1:
The patent applies different material properties to different layers within the thin board structure. The first resin insulating layer uses core material for structural support while the second layer uses non-core material for thermal expansion control, enabling thin design with proper thermal management
Solution Approach 2:
The thin board structure employs composite material layers to achieve high integration density while managing thermal expansion. The combination of core material and non-core material layers creates a composite structure that maintains reliability in a compact form
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The design effectively reduces warpage and enhances connection reliability by balancing thermal expansion coefficients and increasing integration density, while maintaining a thinner board structure.
Implementation Method 1
balancing thermal expansion coefficients and reducing warpage
Data Source
AI summary
A printed wiring board includes a central resin insulating layer, an electronic component embedded in the central resin insulating layer, a first resin insulating layer formed on a first surface side of the central resin insulating layer, and a second resin insulating layer formed on a second surface side of the central resin insulating layer on the opposite side with respect to the first surface side. The central resin insulating layer does not contain a core material, and one of the first resin insulating layer and the second resin insulating layer includes a core material and the other one of the first resin insulating layer and the second resin insulating layer does not contain a core material.