Miniaturized PCB Waveguide Antenna for High-Frequency Noise Detection

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Solution Overview

Problem

Conventional horn antennas are difficult to miniaturize and effectively measure noise sources in small electronic devices due to their larger size, making it challenging to detect high-frequency noise issues in devices using 4G, 5G, Bluetooth, and WiFi communication.

Innovation Solution

A miniaturized antenna device is developed using a printed circuit board with a waveguide antenna structure, featuring conductive areas and vias that form radio wave receiving surfaces, allowing for efficient noise detection and transmission, similar to a horn antenna but with reduced size and production costs.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Measurement precision

If a horn antenna is used to detect high-frequency noise, then the noise detection capability is improved, but the device size becomes large and difficult to miniaturize

Engineering Contradiction:
Improvenoise detection capabilityVSAvoidantenna size
Core Design Contradiction:
Measurement precisionVSVolume of moving object

Solution Approach 1:

The patent creates a simplified copy of the horn antenna structure by using conductive patterns on PCB layers instead of a physical three-dimensional horn structure. This copy maintains the essential waveguide functionality while dramatically reducing size and manufacturing complexity, allowing it to effectively detect high-frequency noise from small electronic devices.

Inventive Principle:
Principle #26Copying

Solution Approach 2:

The patent replaces the mechanical horn antenna structure with an electromagnetic field-based solution implemented through PCB conductive layers and vias. This substitution transitions from a physical mechanical structure to an integrated circuit board implementation, enabling miniaturization while preserving noise detection functionality.

Inventive Principle:
Principle #28Mechanics substitution (Replace mechanical system)

2Measurement precision

If a horn antenna is used for noise measurement, then the measurement accuracy is improved, but the manufacturing complexity and cost increase

Engineering Contradiction:
Improvenoise source measurement accuracyVSAvoidmanufacturing difficulty
Core Design Contradiction:
Measurement precisionVSEase of manufacture

Solution Approach 1:

The patent merges the antenna structure with the PCB board itself by integrating conductive patterns, vias, and grounding structures into the circuit board layers. This consolidation eliminates the need for separate horn antenna components and simplifies manufacturing to standard PCB fabrication processes, significantly reducing manufacturing complexity while maintaining measurement accuracy.

Inventive Principle:
Principle #5Merging (Combining)

Solution Approach 2:

The patent changes the structural parameters from a three-dimensional horn geometry to a two-dimensional PCB layer configuration. By transforming the antenna structure into flat conductive patterns on circuit board layers, the design leverages existing PCB manufacturing capabilities and reduces production complexity while achieving the required electromagnetic performance.

Inventive Principle:
Principle #35Parameter changes

3Volume of moving object

If the antenna size is reduced for miniaturization, then the device compactness is improved, but the reception sensitivity deteriorates

Engineering Contradiction:
Improveantenna sizeVSAvoidreception sensitivity
Core Design Contradiction:
Volume of moving objectVSMeasurement precision

Solution Approach 1:

The patent utilizes the third dimension (vertical stacking of PCB layers) to maintain effective antenna area while reducing the footprint on the board surface. By stacking conductive layers and using vias for vertical connections, the design achieves miniaturization in the horizontal plane while preserving reception sensitivity through multi-layer electromagnetic coupling.

Inventive Principle:
Principle #17Another dimension (Dimensionality change)

Solution Approach 2:

The patent segments the antenna function across multiple PCB layers, with each layer contributing to the overall waveguide structure. The first and second conductive areas on different layers, connected through vias, work together to maintain effective electrical length and reception sensitivity while fitting within a compact form factor.

Inventive Principle:
Principle #1Segmentation

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

The miniaturized antenna device effectively measures and transmits high-frequency noise, improving reception sensitivity and reducing production costs while maintaining the functionality of a horn antenna in a compact form.

Implementation Method 1

a waveguide antenna formed on the printed circuit board, and the waveguide antenna may include a first conductive area formed at a lower portion of the printed circuit board, a second conductive area formed at an upper portion of the printed circuit board and disposed to face the first conductive area, and a plurality of vias, formed at predetermined intervals along edges of the first conductive area, for electrically connecting the first conductive area and the second conductive area

Methodology Applied
Scientific EffectWaveguide: Waveguide

Implementation Method 2

the first conductive area, the second conductive area, and the pair of vias may form a first radio wave receiving surface

Methodology Applied
Scientific EffectElectromagnetic radiation reception: Electromagnetic Induction

Data Source

PatentUS11482776B2Antenna device
Publication Date: 2022.10.25 SAMSUNG ELECTRONICS CO LTD
  • US11482776B2 patent drawing
  • US11482776B2 patent drawing
  • US11482776B2 patent drawing

AI summary

An antenna device is disclosed. The disclosed antenna device comprises: a printed circuit board; and a waveguide antenna formed on the printed circuit board, wherein the waveguide antenna comprises; a first conductive area formed under the printed circuit board; a second conductive area formed above the printed circuit board and disposed to face the first conductive area; and a plurality of vias, formed at predetermined intervals along edges of the first conductive area, for electrically connecting the first conductive area and the second conductive area.