PCB Waveguide Backshort via Conductive Cage
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Solution Overview
Problem
The integration of millimeter-wave components and substrates in distributed systems results in complex and expensive systems due to the need for discrete components like backshort surfaces, waveguides, and transmission lines, which complicates the efficient transportation and guidance of millimeter-waves.
Innovation Solution
A system utilizing a Printed Circuit Board (PCB) with a waveguide and electrically conductive formations, including Vertical Interconnect Access (VIA) holes and conductive surfaces, to direct and guide millimeter-waves, forming an electrically conductive cage over the waveguide aperture, enhancing conductivity and optimizing energy propagation.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If discrete components (backshort surfaces, waveguides, transmission lines) are used for millimeter-wave guidance, then reliable millimeter-wave transportation is achieved, but system complexity and cost increase
Solution Approach 1:
The patent merges multiple discrete millimeter-wave components (backshort surface, waveguide, transmission line) into a single integrated PCB structure. The backshort surface is formed by a conductive layer on the PCB substrate, the waveguide is created through precision-machined cavities in the PCB, and transmission lines are implemented as printed conductive traces. This integration eliminates the need for separate discrete components while maintaining reliable millimeter-wave guidance, directly resolving the contradiction between reliability and system complexity.
Solution Approach 2:
The PCB substrate serves multiple functions simultaneously: it provides the mechanical support structure, forms the backshort surface through conductive layers, creates waveguide cavities through precision machining, and implements transmission lines through printed traces. This multi-functionality allows a single component (the PCB) to replace multiple discrete components, reducing system complexity while maintaining the reliability needed for millimeter-wave transportation.
2Reliability
If discrete components are used for millimeter-wave guidance, then proper wave guidance is achieved, but manufacturing cost increases
Solution Approach 1:
The patent combines multiple discrete components into a single PCB assembly that can be manufactured using standard PCB fabrication processes. The backshort surface, waveguide cavities, and transmission lines are all created during the same manufacturing sequence (substrate preparation, cavity machining, conductive layer deposition, trace printing), eliminating the need for separate assembly steps and reducing overall manufacturing cost while maintaining effective wave guidance.
Solution Approach 2:
The patent changes the manufacturing parameters from precision machining of separate metal components to standard PCB fabrication processes. The waveguide cavities are machined to precise dimensions using PCB-compatible techniques, and conductive surfaces are created through standard PCB lamination and etching processes. This parameter change enables the use of lower-cost manufacturing methods while maintaining the dimensional precision required for effective millimeter-wave guidance.
3Adaptability or versatility
If multiple discrete components are integrated, then millimeter-wave functionality is achieved, but system integration complexity increases
Solution Approach 1:
The patent merges the backshort surface, waveguide, and transmission line into a single integrated PCB structure. The conductive layers on the PCB substrate form the backshort surface, precision-machined cavities create the waveguide passages, and printed conductive traces implement the transmission lines. This merging eliminates the need for complex assembly and alignment of multiple discrete components, reducing integration complexity while maintaining full millimeter-wave functionality.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This solution simplifies the integration of millimeter-wave components within a PCB, reducing complexity and cost while effectively directing and guiding millimeter-waves with improved energy propagation efficiency.
Implementation Method 1
A first electrically conductive surface printed on one of the laminas is located over the aperture such that the first electrically conductive surface covers at least most of the aperture. A plurality of Vertical Interconnect Access (VIA) holes, optionally filled or plated with an electrically conductive material, are electrically connecting the first electrically conductive surface to the waveguide, forming an electrically conductive cage over the aperture.
Implementation Method 2
Optionally, a probe printed on one of the laminas of the PCB is located inside the cage and over the aperture. In one embodiment, the system directs millimeter-waves, transmitted by the probe, towards the waveguide.
Implementation Method 3
The waveguide includes at least one additional lamina belonging to the PCB, having a cavity shaped in the form of the aperture. Optionally, an electrically conductive plating is applied on the walls of the cavity. The cavity is located below the electrically conductive cage.
Data Source
AI summary
A system for directing electromagnetic millimeter-waves towards a waveguide using an electrically conductive formation within a Printed Circuit Board (PCB). The system includes a waveguide having an aperture and at least two laminas belonging to a PCB. A first electrically conductive surface printed on one of the laminas is located over the aperture such that the first electrically conductive surface covers at least most of the aperture. A plurality of Vertical Interconnect Access (VIA) holes, optionally filled or plated with an electrically conductive material, are electrically connecting the first electrically conductive surface to the waveguide, forming an electrically conductive cage over the aperture. Optionally, a probe printed on one of the laminas of the PCB is located inside the cage and over the aperture.