PCB Hollow Waveguide Cavity for Compact Low-Loss Assembly

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Solution Overview

Problem

Existing waveguide arrangements in printed circuit boards require high material input, complex precision manufacturing, and result in large, heavy assemblies due to the use of split-block technology and dielectric-filled waveguides, leading to stability and positioning issues.

Innovation Solution

A waveguide arrangement is created by structuring a conductive backing of a printed circuit board material to form a cavity, using split-block technology to combine a circuit board material with a cover, and applying a conductive layer to surround the cavity, allowing for precise and compact waveguide formation.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Reliability

If split-block technology is used to create waveguide cavities, then waveguide functionality is achieved, but material input and assembly complexity increase significantly

Engineering Contradiction:
Improvewaveguide functionalityVSAvoidassembly complexity
Core Design Contradiction:
ReliabilityVSDevice complexity

Solution Approach 1:

The patent merges the waveguide cavity formation process with the printed circuit board manufacturing process. The cavity is created by removing material from the PCB substrate itself, combining multiple functions (structural support, electrical grounding, and waveguide cavity) into a single integrated component, thereby reducing assembly complexity while maintaining waveguide functionality

Inventive Principle:
Principle #5Merging (Combining)

2Reliability

If dielectric-filled waveguides are used, then waveguide structure is formed, but the assemblies become large and heavy

Engineering Contradiction:
Improvewaveguide structureVSAvoidassembly weight
Core Design Contradiction:
ReliabilityVSWeight of moving object

Solution Approach 1:

The patent extracts the dielectric filling material from the waveguide structure, creating an air-filled or vacuum cavity instead. This removal of heavy dielectric material significantly reduces the overall weight of the assembly while maintaining the structural integrity and electromagnetic waveguiding functionality through the conductive walls formed by the PCB traces and ground planes

Inventive Principle:
Principle #2Taking out (Extraction)

3Manufacturing precision

If high precision manufacturing is applied to split-block parts, then waveguide precision is improved, but manufacturing costs increase

Engineering Contradiction:
Improvewaveguide precisionVSAvoidmanufacturing cost
Core Design Contradiction:
Manufacturing precisionVSEase of manufacture

Solution Approach 1:

The patent makes the printed circuit board serve multiple functions simultaneously: it provides mechanical structural support, establishes electrical ground references through its conductive layers, and forms the waveguide cavity itself through selective material removal. This multi-functionality eliminates the need for separate precision-machined waveguide blocks, thereby reducing manufacturing costs while maintaining the precision required for waveguide operation through standard PCB manufacturing tolerances

Inventive Principle:
Principle #6Universality (Multi-functionality)

Data Source

PatentEP3903376B1Waveguide device
Publication Date: 2025.10.01 2PI LABS GMBH
  • EP3903376B1 patent drawingFigure 1
  • EP3903376B1 patent drawingFigure 2
  • EP3903376B1 patent drawingFigure 2A~2B

AI summary

The invention relates to a hollow waveguide arrangement for conducting electromagnetic waves in a hollow space surrounded by conductive material, wherein the hollow waveguide arrangement comprises a circuit board material, which has an electrically conductive, flat back, a substrate and a conductive layer arranged on the side of the substrate facing away from the back. According to the invention, the back has a surface structure, preferably formed by at least one recess, by which structure the wave-guiding hollow space is at least partially directly delimited; and/or the hollow space is formed in a split-block technique by connecting the circuit board material as a split-block base to a corresponding cover as a split-block top part.