Laminated PCB Waveguide Cavity for Millimeter-Wave Signal Integration
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Solution Overview
Problem
The integration of millimeter-wave components and substrates in distributed systems results in complex and expensive systems due to the need for discrete components like backshort surfaces, waveguides, and transmission lines, which complicates the transportation and guidance of millimeter-wave signals.
Innovation Solution
A method for constructing millimeter-wave laminate structures using Printed Circuit Board (PCB) processes, involving the creation of laminates with cavities shaped as waveguide apertures, electrically conductive plating, and the integration of bare-die Integrated Circuits with wire-bonded transmission lines to efficiently guide and interface millimeter-wave signals.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If discrete components (backshort surfaces, waveguides, transmission lines) are used to guide millimeter-wave signals, then signal guidance capability is achieved, but system complexity and cost increase
Solution Approach 1:
The patent combines multiple discrete millimeter-wave components (waveguide, backshort surface, transmission line) into a single integrated PCB structure. The waveguide cavity is formed by etching conductive traces on PCB laminas, the backshort surface is created by plating the cavity interior, and transmission lines are routed through the PCB layers, eliminating the need for separate discrete components while maintaining signal guidance functionality.
Solution Approach 2:
The PCB structure serves multiple functions simultaneously: it provides mechanical support, guides millimeter-wave signals through the waveguide cavity, provides electrical connections through plated traces, and creates the resonant cavity structure. This multi-functional integration reduces the number of separate components needed and simplifies the overall system architecture.
2Reliability
If discrete components are used for millimeter-wave systems, then signal transmission is achieved, but manufacturing cost increases
Solution Approach 1:
The patent integrates waveguide, backshort, and transmission line functions into a single PCB manufacturing process. Conductive traces are etched on PCB laminas to form waveguide cavities, interior surfaces are plated with conductive material to create backshort surfaces, and signal transmission is achieved through integrated traces, eliminating the need to source and assemble multiple expensive discrete millimeter-wave components.
Solution Approach 2:
The patent changes the manufacturing approach from assembling discrete precision-machined components to using standard PCB fabrication processes. The waveguide cavity dimensions are defined by PCB trace geometry rather than mechanical machining, and the backshort surface is created through electroplating rather than separate component fabrication, significantly reducing manufacturing costs.
3Device complexity
If PCB processes are used to integrate millimeter-wave components, then system complexity is reduced, but manufacturing precision requirements increase
Solution Approach 1:
The patent changes the dimensional tolerance regime from mechanical machining tolerances to PCB fabrication tolerances. The waveguide cavity dimensions are defined by etched trace widths and spacing, which can be controlled with standard PCB fabrication precision (typically ±0.05mm to ±0.1mm), avoiding the need for expensive precision machining while maintaining electromagnetic performance.
Solution Approach 2:
The patent applies different precision requirements to different regions of the PCB structure. Critical dimensions for electromagnetic performance (cavity resonant frequency, waveguide aperture dimensions) are controlled through precise trace geometry in the waveguide region, while less critical areas use standard PCB tolerances, optimizing the balance between manufacturing ease and performance.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This approach simplifies the construction of millimeter-wave systems by integrating components within a PCB, reducing complexity and cost while effectively guiding and interfacing millimeter-wave signals with high frequency capabilities.
Implementation Method 1
Plating the cavity with electrically conductive plating, using a PCB plating process
Implementation Method 2
An electrically conductive contact on the bare-die Integrated Circuit is wire-bonded with a transmission line signal trace
Data Source
AI summary
A method for constructing millimeter-wave laminate structures using Printed Circuit Board (PCB) processes includes the following steps: Creating a first pressed laminate structure comprising at least two laminas and a cavity, the cavity is shaped as an aperture of a waveguide, and goes perpendicularly through all laminas of the laminate structure. Plating the cavity with electrically conductive plating, using a PCB plating process. Pressing the first pressed laminate structure together with at least two additional laminas comprising a probe printed on one of the at least two additional laminas, into a PCB comprising the first pressed laminate structure and the additional laminas, such that the cavity is sealed only from one end by the additional laminas and the probe, and the probe is positioned above the cavity.