Optical Waveguide Electronic Assembly for Near-Chip Current Measurement
Find Innovative SolutionsGenerate Solutions
Solution Overview
Problem
Current methods for measuring current flow in electronic assemblies, particularly in power electronics modules, are limited to external measurements and do not allow for chip-level or component-level measurements.
Innovation Solution
An electronic assembly design that incorporates a glass plate with an optical waveguide and contacts arranged vertically, utilizing the optical Faraday effect to measure current flow by deflecting polarized laser light, allowing for near-chip current measurements.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Measurement precision
If external measurement methods (shunt resistors or Hall effect converters) are used, then current measurement is possible, but component-level measurement capability is not achieved
Solution Approach 1:
The glass plate with integrated waveguide is nested within the assembly structure between the carrier plate and component, allowing the measurement function to be embedded within the existing assembly rather than added as a separate external system
Solution Approach 2:
The glass plate serves as an intermediary element that simultaneously provides mechanical support and enables optical measurement. It mediates between the electrical current (through the contact) and the optical field (through the waveguide), allowing non-contact current measurement via the Faraday effect
2Measurement precision
If a glass plate with waveguide is inserted into the assembly, then near-chip current measurement is enabled, but assembly space increases
Solution Approach 1:
The glass plate is designed as a thin component with thickness between 200 μm and 1 mm, allowing it to be integrated into the assembly with minimal space occupation while still providing the necessary optical waveguide functionality for current measurement
3Ease of operation
If contacts are guided vertically through the glass plate, then optical measurement path is created, but electrical isolation requirements must be met
Solution Approach 1:
The glass plate acts as an electrical insulator that mediates between the conductive contact and the optical waveguide. It allows the contact to pass through vertically for both electrical connection and optical measurement purposes while maintaining electrical isolation between different potential components
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
Enables accurate, component-level current measurement within power electronics assemblies with minimal space increase, using standard assembly technologies and ensuring electrical isolation.
Implementation Method 1
an optical waveguide is structured into the glass plate
Implementation Method 2
This magnetic field, utilizing the optical Faraday effect, deflects polarized laser light passing through the waveguide integrated into the glass plate
Data Source
Figure 1
Figure 2a~2b
Figure 3
AI summary
The invention relates to an electronic assembly (2) comprising at least one electronic component (4) and at least one printed circuit board (8), wherein the component (4) and the printed circuit board (8) extend horizontally to each other in different planes (E1, E2... En) within the assembly (2), wherein the contacts (10) of the electronic component (4) extend vertically in the assembly (2).The invention is characterized in that - a glass plate (12) is inserted into the assembly (2) in a horizontal installation position, - which has a horizontal recess (14) through which at least a part of the contacts (10) are guided, wherein - an optical waveguide (16) is structured into the glass plate (12) and - the glass plate has two optical connection points (32, 34) on the waveguide (15) by means of which polarized laser light (20) can be coupled into and out of the waveguide (16) and - the glass plate (12) with the recess (14) is arranged between a carrier plate (6) and the component (4).