PCB Waveguide Launch Transducer Without Wire Bonding
Find Innovative SolutionsGenerate Solutions
Solution Overview
Problem
Existing waveguide interface technologies for millimeter wave semiconductor devices are costly and inefficient, particularly due to the need for wire bonding and orthogonal energy transfer methods that are not compatible with wafer level chip scale packaging techniques.
Innovation Solution
A waveguide assembly with an integrated launch transducer on a printed circuit board assembly, compatible with wafer level chip scale packaging, that uses a support block and waveguide interface to secure the board assembly, allowing for efficient millimeter wave frequency signal propagation without the need for wire bonding.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If wire bonding is used to connect semiconductor die to printed circuit board, then electrical connection is achieved, but manufacturing cost increases and yield problems occur
Solution Approach 1:
The patent extracts the wire bonding process entirely by integrating the semiconductor die directly into the printed circuit board substrate. The die is mounted in a recessed cavity and electrically connected through conductive vias and traces formed within the board layers, eliminating the need for separate wire bonding operations and their associated cost and reliability issues.
Solution Approach 2:
The patent merges the semiconductor die mounting, electrical connection, and signal transmission functions into a single integrated structure. The die, conductive pathways, and PCB traces are combined into one monolithic assembly where the die pads are directly coupled to transmission lines through the board's internal conductive layers, eliminating intermediate connection steps.
2Use of energy by moving object
If orthogonal planar printed circuit launch probe is used to couple energy from waveguide, then energy transfer is achieved, but energy loss increases due to lossy transfer
Solution Approach 1:
The patent transitions from orthogonal (90-degree) energy coupling to coplanar (in-plane) energy transfer. The transmission lines on the PCB are oriented parallel to the waveguide aperture rather than perpendicular, allowing the electromagnetic fields to couple more efficiently along the same plane, thereby reducing mismatch losses and improving overall energy transfer efficiency.
3Adaptability or versatility
If additional substrate is added to printed circuit board for stub or paddle energy launch, then energy coupling capability is improved, but device complexity and manufacturing cost increase
Solution Approach 1:
The patent combines the energy launch functionality directly into the existing PCB substrate by forming conductive transmission lines and ground planes within the board's internal layers. The stub or paddle launch structures are created using the PCB's own conductive traces and vias, eliminating the need for separate attachment substrates and reducing overall structural complexity.
Solution Approach 2:
The patent makes the printed circuit board substrate perform multiple functions simultaneously: it provides mechanical support for the semiconductor die, creates electrical connections through internal conductive pathways, and serves as the energy launch structure for millimeter wave coupling. This multi-functional integration eliminates the need for dedicated energy launch substrates.
4Adaptability or versatility
If split-cavity assembly method is used for orthogonal launch, then energy coupling is achieved, but manufacturing expense increases
Solution Approach 1:
The patent segments the waveguide cavity into distinct regions: a first cavity portion for receiving the PCB assembly with the semiconductor die, and a second cavity portion for the energy launch structure. This segmentation allows each portion to be optimized independently and assembled separately, then joined together, simplifying the manufacturing process compared to complex split-cavity methods while maintaining effective energy coupling.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The solution provides a cost-effective and efficient interface for millimeter wave semiconductor devices, reducing costs and maintaining high performance by eliminating the need for wire bonding and enabling compatibility with surface mount technologies.
Implementation Method 1
The transducer element is configured to propagate millimeter wave frequency signals
Implementation Method 2
A first metallic layer is located on at least a portion of the extended portion of the dielectric layer. The first metallic layer and the dielectric layer are configured to form a launch transducer comprising one or more transmission lines and at least one transducer element
Data Source
Figure 1A~1C
Figure 2
Figure 3
AI summary
A printed circuit board assembly comprising a plurality of layers. At least one of the plurality of layers is formed of a dielectric material and has an extended portion extending beyond the other layers in the plurality of layers. A first metallic layer is located on at least a portion of the extended portion of the dielectric layer. The first metallic layer and the dielectric layer are configured to form a launch transducer comprising one or more transmission lines and a transducer element coupled to the one or more transmission lines. The transducer element is configured to propagate millimeter wave frequency signals.