PCB Waveguide Coupling for Surface-Mount mmWave Transceivers
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Solution Overview
Problem
The existing manufacturing processes for mmWave transceiver devices are complex and costly due to the need for separate waveguide flanges for transmitter and receiver modules, which increases assembly time and costs.
Innovation Solution
A surface mount constructed millimeter wave transceiver device is developed, where a diplexer and transmitter/receiver waveguide packages are surface mounted directly onto a printed circuit board (PCB) with waveguide ports, eliminating the need for separate waveguide flanges.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Loss of energy
If separate waveguide flanges are used for transmitter and receiver modules, then electrical connectivity and low energy loss are achieved, but device complexity and manufacturing cost increase
Solution Approach 1:
The patent merges the transmitter and receiver waveguide interfaces into a single integrated waveguide port on the PCB. Instead of using separate waveguide flanges for TX and RX modules, the design integrates both interfaces through one unified waveguide port, eliminating the need for additional mechanical flanges and reducing overall device complexity while maintaining low energy loss performance
Solution Approach 2:
The single waveguide port on the PCB serves multiple functions by simultaneously providing the interface for both the transmitter module and the receiver module. This multi-functional design eliminates the need for separate dedicated waveguide ports for each module, thereby reducing device complexity and simplifying the overall architecture
2Reliability
If separate waveguide flanges are used for transmitter and receiver modules, then electrical connectivity is achieved, but assembly time and manufacturing cost increase
Solution Approach 1:
The patent combines multiple waveguide interface functions into a single integrated waveguide port structure on the PCB. This merging eliminates the need for separate assembly steps for multiple waveguide flanges, thereby reducing assembly time and manufacturing complexity while maintaining reliable electrical connectivity for both transmitter and receiver modules
3Reliability
If electrical conductors such as wire bonds or SMT package electrical pins are used, then interconnection between die and circuitry is achieved, but electrical losses due to resistance, inductance, and capacitance increase
Solution Approach 1:
The patent replaces traditional electrical conductor-based interconnection methods (wire bonds, SMT package electrical pins) with a waveguide-based electromagnetic coupling system. The waveguide port enables direct electromagnetic energy transfer between the mmWave semiconductor package and the PCB, eliminating the need for electrical conductors and thereby reducing electrical losses associated with resistance, inductance, and capacitance
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This approach simplifies manufacturing, reduces costs, and enables efficient electromagnetic energy transfer and coupling between packages and a diplexer, while allowing for easy configuration changes between high and low transmit settings without altering parts or fabrication techniques.
Implementation Method 1
a waveguide port that is configured to transfer electromagnetic energy from the mmWave semiconductor package to the printed circuit board without any electrical conductors
Implementation Method 2
The use of a frequency filter diplexer allows the ability for FDD operation by isolating the transmitter energy from desensitizing the local receiver while coupling both the transmitter and the receiver to a common antenna
Data Source
AI summary
A surface mount constructed millimeter wave transceiver device and methods of making a surface mount constructed millimeter wave transceiver device are disclosed. The transceiver device includes a printed circuit board having a first waveguide port and a second waveguide port. A diplexer is surface mounted to a first side of the printed circuit board, the diplexer comprising a low frequency waveguide port and a high frequency waveguide port each coupled to an antenna port. A transmitter and a receiver are surface mounted to a second side of the printed circuit board, located opposite the first side of the printed circuit board, wherein the transmitter and the receiver comprise a transmitter waveguide port and a receiver waveguide port, respectively, that are configured to be aligned to the first waveguide port and the second waveguide port of the printed circuit board, respectively.


