PCB Waveguide Structure Without SIW Via Holes
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Solution Overview
Problem
Substrate Integrated Waveguide (SIW) transmission lines require a large number of metallic conductive holes with high position accuracy, leading to high costs and transmission loss during microwave transmission.
Innovation Solution
A circuit board structure with a waveguide is manufactured using a conductive plate and a circuit board, where the conductive plate is bonded to the circuit board using an adhesive layer, eliminating the need for metallic through holes and allowing electromagnetic waves to propagate in air, reducing transmission loss.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If substrate integrated waveguide is formed using metallic conductive holes, then waveguide transmission characteristics are achieved, but manufacturing cost increases and transmission loss occurs
Solution Approach 1:
The patent extracts and removes the metallic conductive holes from the dielectric substrate, replacing them with a conductive plate structure. This eliminates the need for drilling and filling numerous holes, thereby reducing manufacturing complexity and cost while maintaining waveguide functionality through the conductive plate's top wall and sidewalls configuration.
Solution Approach 2:
The patent changes the structural parameters from a hole-based SIW configuration to a plate-based waveguide structure. By modifying the physical form from discrete conductive holes to a continuous conductive plate with notches and sidewalls, the invention achieves waveguide characteristics with reduced manufacturing steps and lower cost.
2Reliability
If substrate integrated waveguide is formed using metallic conductive holes, then waveguide transmission characteristics are achieved, but transmission loss increases
Solution Approach 1:
The patent removes the metallic conductive holes that cause transmission loss through their discrete structure and interfaces. By extracting these lossy elements and replacing them with a continuous conductive plate structure, the invention reduces energy loss while maintaining the necessary waveguide transmission characteristics through the plate's geometric configuration.
3Device complexity
If a large number of metallic conductive holes are used, then waveguide structure is formed, but manufacturing precision requirements increase
Solution Approach 1:
The patent merges numerous discrete conductive holes into a single integrated conductive plate structure. This consolidation reduces the number of manufacturing steps from drilling and filling many individual holes to forming and bonding one plate, thereby reducing the cumulative position accuracy requirements and overall manufacturing precision demands.
Solution Approach 2:
The conductive plate structure serves as a simplified copy or alternative representation of the traditional hole-based SIW structure. Instead of creating many precise holes, the invention uses a plate with notches that replicates the waveguide functionality with fewer, more easily manufactured features.
Data Source
AI summary
A method for manufacturing a circuit board structure with a waveguide is provided. The method includes: providing a plate including a top wall and sidewalls disposed on the top wall, an opening being defined between ends of two adjacent sidewalls away from the top wall; forming a conductive layer on the plate to obtain a conductive plate; providing a circuit board, the circuit board comprising an outer circuit layer; mounting the conductive plate on the outer circuit layer, causing the outer circuit layer to be disposed on the opening. The two adjacent sidewalls, the top wall between the two adjacent sidewalls, and the circuit board between the two adjacent sidewalls cooperatively constitutes a tube body of the waveguide, and the conductive layer and the outer circuit layer on an inner surface of the tube body cooperatively constitute a shielding of the waveguide.