PCB Winding Active EMI Filter Module for Vehicle Power Lines
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Solution Overview
Problem
Conventional EMI filters for electric vehicles face challenges due to the high cost and size of CM chokes, as well as limitations in performance uniformity and mass productivity, and increased leakage current when trying to achieve high attenuation rates.
Innovation Solution
The solution involves replacing the offset part of the active EMI filter module with a printed circuit board (PCB) winding structure, forming a stacked structure with a sensor and offset unit to detect and remove common mode electromagnetic interference (EMI) noise, using a controller with an operational amplifier and transistor to generate an offset voltage, and incorporating passive components for noise removal.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Object-affected harmful factors
If a CM choke with high-grade core is used to achieve high attenuation rate, then EMI noise reduction is improved, but size and price are increased
Solution Approach 1:
The patent replaces the conventional CM choke with a PCB winding structure that integrates the inductor function directly into the circuit board. This substitution eliminates the need for separate magnetic components, achieving the same EMI filtering effect through PCB trace windings while significantly reducing overall size and cost.
Solution Approach 2:
The patent merges the CM choke function with the PCB structure by creating integrated windings on the circuit board. The PCB serves dual purposes as both the circuit carrier and the inductive element, combining multiple functions into a single integrated component to reduce size and part count.
2Manufacturing precision
If manual winding assembly is used for CM choke, then performance uniformity is improved, but productivity is reduced
Solution Approach 1:
The patent replaces manual winding assembly with automated PCB manufacturing processes. The PCB winding structure is created through standard PCB fabrication techniques including copper trace patterning and plating, which are highly automated and consistent, thereby improving both productivity and performance uniformity through manufacturing standardization.
Solution Approach 2:
The patent changes the manufacturing approach from mechanical winding to PCB fabrication parameter control. By controlling PCB manufacturing parameters such as copper thickness, trace width, and winding pattern during automated fabrication, the invention achieves consistent performance across mass production while eliminating manual assembly limitations.
3Object-affected harmful factors
If Y-Capacitor capacity is increased to achieve high attenuation rate, then EMI noise reduction is improved, but leakage current is increased
Solution Approach 1:
The patent replaces the Y-capacitor-based passive filtering approach with an active EMI filter that uses operational amplifiers and transistors to actively compensate for noise. This active substitution allows for effective EMI reduction without relying on large capacitor values that would increase leakage current, thereby resolving the trade-off between attenuation performance and energy loss.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This approach enhances productivity, reduces module size, and achieves effective EMI noise reduction with improved performance consistency and reduced leakage current.
Implementation Method 1
a sensor (101) configured to detect common mode electromagnetic interference (EMI) noise of a power line
Implementation Method 2
a first winding (111) configured to receive the offset voltage generated by the controller
Implementation Method 3
a second winding (112) configured to transform the offset voltage and supply the transformed voltage to the power line
Implementation Method 4
a core (121) configured to electrically connect the first winding and the second winding
Data Source
AI summary
A vehicle electronic module is provided. The vehicle electronic module has a reduced size and improved productivity by replacing a sensor and an offset unit of an electromagnetic interference (EMI) filter module with a printed circuit board (PCB) winding structure. The electronic module includes a sensor that detects EMI noise of a power line and an offset unit that transmits an offset voltage for removing the EMI noise to the power line. A controller is configured to generate the offset voltage that corresponds to the EMI noise detected by the sensor. Then sensor and the offset unit are formed in a stacked structure of the PCB.