Printed Board Wiring Pattern Deterioration Detection via Solder Resist Segmentation
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Solution Overview
Problem
Existing printed boards face challenges in detecting deterioration due to environmental stress, such as mist from cutting liquids, which can lead to corrosion and failure, and current methods for early detection are not effective in preventing maintenance guidelines and reduce manufacturing yield.
Innovation Solution
A printed board design featuring a wiring pattern for detection with a thin film section of solder resist and a thick film section, where the wiring pattern is either partially or fully surrounded by the thick film section, allowing for early detection of deterioration while minimizing yield reduction in the manufacturing process.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Measurement precision
If solder resist is made thin or not formed on the wiring pattern for detecting deterioration, then early detection of deterioration is enabled, but manufacturing yield is reduced due to increased corrosion risk
Solution Approach 1:
The solder resist is divided into multiple thickness regions: a first thickness region (thinner) covering the detection wiring pattern to enable early deterioration detection, and a second thickness region (thicker) covering other wiring patterns to maintain manufacturing yield and corrosion resistance. This segmentation allows different functional requirements to be satisfied in different areas.
Solution Approach 2:
The solder resist is designed with non-uniform thickness distribution, where the thickness is specifically reduced only in the area covering the detection wiring pattern, while maintaining standard thickness in other areas. This local quality adjustment enables targeted deterioration detection without compromising overall board reliability or manufacturing yield.
2Measurement precision
If the wiring pattern width or insulating gap is made narrower to enable earlier deterioration detection, then detection sensitivity is improved, but manufacturing precision requirements increase and yield decreases
Solution Approach 1:
Instead of changing the geometric parameters (width, insulating gap) of the detection wiring pattern, the invention changes the thickness parameter of the solder resist covering the pattern. This parameter substitution maintains standard manufacturing precision requirements while achieving the goal of enhanced deterioration detection sensitivity through the thinner solder resist region.
3Measurement precision
If solder resist is completely removed from the detection wiring pattern to enable early detection, then deterioration detection capability is maximized, but corrosion resistance and reliability are compromised
Solution Approach 1:
The solder resist coverage is segmented such that the detection wiring pattern area has reduced thickness (first thickness region) for enhanced detection capability, while surrounding areas maintain full thickness coverage (second thickness region) for corrosion protection. This segmentation balances detection sensitivity with reliability.
Solution Approach 2:
Instead of completely removing solder resist from the detection wiring pattern, the invention applies a partial reduction in thickness. This partial action provides sufficient deterioration detection capability while maintaining adequate corrosion resistance, avoiding the extreme of complete removal that would compromise reliability.
Data Source
AI summary
A printed board with a wiring pattern for detecting deterioration includes an insulating substrate, a wiring pattern group that is formed on the insulating substrate and includes a wiring pattern for detecting deterioration; and a solder resist covering the wiring pattern group, in which the board has a thin film section, and a thick film section in which a thickness of the solder resist is larger than the thin film section, and the wiring pattern for detecting deterioration is formed in the thin film section whose entire surrounding area or partial surrounding area is surrounded by the thick film section.