PCBA Fixture Bar with Matching CTE for Component Positioning

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Solution Overview

Problem

The expansion and contraction of Printed Circuit Board (PCB) substrates during assembly thermal processes lead to distortion and out-of-tolerance conditions of components on finished assemblies, necessitating a method to maintain critical spacing and tolerances.

Innovation Solution

A spring-loaded mechanical retention device is integrated into PCBA manufacturing fixtures, featuring a tooling bar with the same Coefficient of Thermal Expansion (CTE) as the PCB, which uses movable and fixed pins coupled via a spring assembly to maintain absolute and relative positions of components, reducing displacement during wave soldering or reflow operations.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Productivity

If conventional PCBA holding fixtures are used during wave soldering or reflow operations, then the assembly process can be completed, but component displacement and distortion occur due to PCB substrate expansion and contraction

Engineering Contradiction:
Improveassembly process completionVSAvoidcomponent position tolerance
Core Design Contradiction:
ProductivityVSManufacturing precision

Solution Approach 1:

The bar is designed with a specific Coefficient of Thermal Expansion (CTE) that matches the PCB substrate material. This parameter change ensures that the bar expands and contracts at the same rate as the PCB during thermal processes, preventing relative displacement between the bar and PCB while maintaining component position tolerance throughout the assembly process

Inventive Principle:
Principle #35Parameter changes

Solution Approach 2:

The bar serves as an intermediary element between the fixture and the PCB. It couples the fixture to the PCB in a way that accommodates thermal expansion while maintaining mechanical constraint. The bar acts as a mediator that transfers thermal effects uniformly without causing distortion or displacement of mounted components

Inventive Principle:
Principle #24Intermediary (Mediator)

2Ease of manufacture

If the PCB substrate is heated during wave soldering or reflow operations, then soldering can be performed, but the PCB expands and contracts causing component distortion

Engineering Contradiction:
Improvesoldering operationVSAvoidcomponent alignment
Core Design Contradiction:
Ease of manufactureVSShape

Solution Approach 1:

The bar's CTE is specifically selected to match the PCB substrate material properties. This ensures that during thermal soldering operations, the bar and PCB expand and contract together at the same rate, maintaining component alignment and preventing distortion while allowing the soldering process to proceed normally

Inventive Principle:
Principle #35Parameter changes

3Manufacturing precision

If a rigid fixture is used to hold the PCB during thermal processes, then component position can be maintained, but the fixture itself may distort due to thermal expansion mismatch

Engineering Contradiction:
Improvecomponent position maintenanceVSAvoidfixture dimensional stability
Core Design Contradiction:
Manufacturing precisionVSStability of the object's composition

Solution Approach 1:

The bar is designed with a CTE matching the PCB substrate rather than using a standard rigid fixture material. This parameter change allows the fixture component to maintain dimensional stability relative to the PCB during thermal processes, preventing distortion while maintaining component position

Inventive Principle:
Principle #35Parameter changes

Solution Approach 2:

The bar is constructed from a material with specific thermal expansion properties that complement the PCB substrate. This creates a composite-like behavior where the bar and PCB respond cohesively to thermal changes, maintaining structural integrity and component alignment throughout the thermal process

Inventive Principle:
Principle #40Composite materials

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

This solution effectively constrains thermal-induced dimensional changes, ensuring components remain aligned within specified tolerances, preventing misalignment issues and enhancing manufacturing precision.

Implementation Method 1

The spring may be configured to maintain an absolute position of the first hole during manufacturing of the PCBA

Methodology Applied
Scientific EffectElasticity: Elasticity

Implementation Method 2

The bar may have the same Coefficient of Thermal Expansion (CTE) as the PCBA

Methodology Applied
Scientific EffectThermal Expansion: Thermal Expansion

Data Source

PatentUS10750647B2Reducing displacement of selected components during printed circuit board assembly (PCBA) manufacturing
Publication Date: 2020.08.18 DELL PROD LP
  • US10750647B2 patent drawing
  • US10750647B2 patent drawing
  • US10750647B2 patent drawing

AI summary

Systems and methods for reducing displacement of selected components during Printed Circuit Board Assembly (PCBA) manufacturing are described. In some embodiments, a PCBA manufacturing tool may include: a bar having a first end and a second end; a movable pin coupled to the first end, the movable pin configured to be inserted into a first hole of a PCB; and a fixed pin coupled to the second end, the fixed pin configured to be inserted into a second hole of the PCB.