PCBA Packaging Structure Using Composite Support and Foamed Polypropylene

Resolve Bottlenecks,
Find Innovative Solutions
Generate Solutions

Solution Overview

Problem

Existing packaging structures for printed circuit board assemblies (PCBAs) lack sufficient mechanical strength to provide a reliable fixing structure for secure installation or assembly, especially when integrated into vehicle frames or other external structures.

Innovation Solution

A method involving a support with a fixing structure that is either integrally formed or separately assembled, used in conjunction with a moulding process to encapsulate the PCBAs with a polymer material, forming a packaging structure that securely fixes the PCBAs to external structures, such as vehicle frames, using compatible materials like foaming polypropylene and over-moulding or insert-moulding processes.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Weight of moving object

If packaging material with low density (e.g., foamed polypropylene) is used to achieve light weight and reduce component number, then weight is reduced and component count decreases, but mechanical strength and ability to provide fixing structure deteriorates

Engineering Contradiction:
Improveweight of packaging structureVSAvoidmechanical strength of packaging structure
Core Design Contradiction:
Weight of moving objectVSStrength

Solution Approach 1:

The patent uses a composite structure combining a support (made of strong material like metal or rigid plastic) with packaging material (foamed polypropylene or similar). The support provides the necessary mechanical strength and fixing structure, while the packaging material provides lightweight protection and isolation. This composite approach resolves the contradiction by integrating materials with complementary properties.

Inventive Principle:
Principle #40Composite materials

Solution Approach 2:

The packaging system is divided into two functional segments: a support structure responsible for mechanical strength and fixation, and a packaging material responsible for lightweight protection. This segmentation allows each component to optimize its specific function without compromising the other, enabling the overall system to achieve both light weight and sufficient strength.

Inventive Principle:
Principle #1Segmentation

2Weight of moving object

If packaging material with low density is used to achieve light weight, then weight is reduced, but ability to provide fixing structure for reliable installation deteriorates

Engineering Contradiction:
Improveweight of packaging structureVSAvoidreliability of installation
Core Design Contradiction:
Weight of moving objectVSReliability

Solution Approach 1:

The support structure made of strong material provides reliable fixing features (such as mounting holes, attachment points, or integrated fastening mechanisms) that ensure reliable installation to vehicle frames or other structures. The lightweight packaging material surrounds and protects the support-PCBA assembly without compromising the installation reliability provided by the support structure.

Inventive Principle:
Principle #40Composite materials

Solution Approach 2:

The functions of protection and fixation are segmented into different components: the support structure handles fixation and installation reliability, while the packaging material handles protection and weight reduction. This functional segmentation resolves the contradiction between light weight and installation reliability.

Inventive Principle:
Principle #1Segmentation

Data Source

PatentUS11284524B2Printed circuit board assembly and packaging method thereof, and motor vehicle
Publication Date: 2022.03.22 VALEO COMFORT & DRIVING ASSISTANCE
  • US11284524B2 patent drawing
  • US11284524B2 patent drawing
  • US11284524B2 patent drawing

AI summary

Embodiments of the present invention provide a method for packaging a printed circuit board assembly (PCBA), a packaged PCBA module, and a motor vehicle. The method includes: providing a printed circuit board assembly comprising a printed circuit board (PCB) and a plurality of elements assembled on the printed circuit board; providing a support constructed to carry the printed circuit board assembly and define a space for accommodating the printed circuit board assembly; placing the printed circuit board assembly in the space of the support to enable the support to carry and position the printed circuit board assembly, and placing the support and the printed circuit board assembly carried thereby in a mould; and filling the mould with a polymer material using a moulding process so as to form a packaging structure encapsulating at least the printed circuit board assembly and fixing the printed circuit board assembly relative to the support.