PCBA Thermal Management via Conformable TIM and Heat Conductor
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Solution Overview
Problem
Solid state data storage devices face heat build-up issues due to limited air circulation and small size of enclosures, leading to performance degradation and reduced component lifespan, especially when multiple devices are stacked, and existing thermal interface materials struggle with conformability and void formation.
Innovation Solution
A thermal interface material (TIM) is used between the printed circuit board assembly (PCBA) and covers, providing a conformable, thermally conductive path that contacts both the cap and peripheral edge of the circuitry package, and a heat conductor is attached to the printed circuit board to direct heat away from hot spots, enhancing thermal conductivity and mechanical robustness.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Temperature
If traditional thermal interface materials are used in enclosed PCBA designs, then thermal conduction is achieved, but conformability to irregular surfaces is poor and voids form reducing thermal efficiency
Solution Approach 1:
The patent employs a conformable thermal interface material that can flex and adapt to irregular surfaces of the PCBA and circuitry package. This flexible material eliminates voids and ensures complete surface contact, resolving the contradiction between achieving thermal conduction and maintaining reliable thermal contact quality.
Solution Approach 2:
The patent modifies the physical parameters of the thermal interface material to enhance its conformability while maintaining thermal conductivity. By changing material properties such as flexibility and compliance, the solution achieves both effective heat conduction and reliable thermal contact without void formation.
2Volume of moving object
If the PCBA is enclosed in a compact device, then device size is reduced, but heat dissipation becomes difficult leading to heat build-up
Solution Approach 1:
The patent introduces a thermally conductive structure that acts as an intermediary between the heat-generating circuitry package and the enclosure. This mediator efficiently transfers heat from the compact PCBA to the enclosure walls, enabling effective heat dissipation despite the reduced device volume.
Solution Approach 2:
The enclosure is designed to serve multiple functions: it provides mechanical protection for the PCBA and simultaneously acts as a heat dissipation pathway. By making the enclosure thermally conductive, it becomes a dual-purpose component that addresses both size reduction and heat dissipation requirements.
3Adaptability or versatility
If multiple circuitry packages are mounted on the PCBA, then functionality is increased, but heat generation increases leading to performance degradation
Solution Approach 1:
The patent employs a thermally conductive structure as an intermediary that intercepts heat from multiple circuitry packages before it can accumulate and cause performance degradation. This mediator provides dedicated thermal pathways that scale with the number of packages, maintaining functionality while managing heat generation.
4Strength
If the printed circuit board is made more rigid to improve shock resistance, then mechanical strength increases, but thermal conduction capability decreases
Solution Approach 1:
The patent separates the structural support function from the thermal conduction function. The printed circuit board maintains its rigidity for shock resistance, while a dedicated thermally conductive structure handles heat transfer. This segmentation allows each component to be optimized for its specific function without compromise.
Solution Approach 2:
The patent introduces a separate thermally conductive structure that acts as an intermediary for heat transfer, allowing the printed circuit board to remain rigid for shock resistance. The mediator captures heat from the circuitry packages and transfers it to the enclosure, maintaining thermal conduction capability independent of the board's mechanical rigidity.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The solution effectively conducts heat away from the PCBA, maintaining operational integrity, increasing component lifespan, and improving shock resistance by reducing mechanical stress and bending of the printed circuit board, while also providing a cost-effective and reusable thermal management system.
Implementation Method 1
The TIM defines an opening that is sized to receivingly engage the circuitry package in a close mating engagement operably contacting the TIM simultaneously against the cap and the peripheral edge to conduct heat away from the circuitry package
Implementation Method 2
A heat conductor is attached to the other side of the printed circuit board in an overlapping opposition to the circuitry package to conduct heat away from the printed circuit board that is generated by the circuitry package
Data Source
AI summary
A printed circuit board assembly (PCBA) is connected to a frame within a passage. The PCBA includes a circuitry package attached to a printed circuit board. The circuitry package has a peripheral edge extending from the printed circuit board to a distal end joined to a cap. A cover is attached to the frame to enclose the PCBA. A thermal interface material (TIM) is disposed between the cover and the PCBA, the TIM defining an opening sized to receivingly engage the circuitry package in a close mating engagement contacting the TIM simultaneously against the cap and the peripheral edge to conduct heat away from the circuitry package. A heat conductor attached to the other side of the printed circuit board in an overlapping opposition to the circuitry package conducts heat away from the printed circuit board that is generated by the circuitry package.