PCB-Less Semiconductor Package Assembly to Reduce Warpage
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Solution Overview
Problem
Conventional semiconductor devices and manufacturing methods result in excessively thick, warped, and expensive components due to the use of printed circuit boards (PCBs).
Innovation Solution
A manufacturing method for semiconductor devices that omits the use of PCBs by forming a back end of line (BEOL) layer on a dummy substrate, electrically connecting a semiconductor die, encapsulating with encapsulants, and connecting a solder ball and semiconductor package to the BEOL layer without a PCB, utilizing fine redistribution layers and conductive pillars.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Length of stationary object
If a printed circuit board (PCB) is used in conventional semiconductor devices, then electrical connectivity and structural support are provided, but the device becomes excessively thick, warped, and expensive
Solution Approach 1:
The patent extracts and eliminates the PCB from the semiconductor device structure, removing the source of thickness and warpage while maintaining electrical connectivity through alternative means (solder balls and encapsulants directly connecting components)
Solution Approach 2:
The encapsulant serves multiple functions: it provides electrical connectivity (replacing PCB traces), structural support (replacing PCB substrate), and environmental protection, thereby eliminating the need for a separate PCB
2Ease of manufacture
If a printed circuit board (PCB) is used in conventional semiconductor devices, then structural support is provided, but manufacturing costs increase
Solution Approach 1:
The patent merges the structural support function with the encapsulant material, combining what were previously separate components (PCB substrate and encapsulant) into a single integrated structure that reduces manufacturing steps and costs
3Reliability
If a printed circuit board (PCB) is used in conventional semiconductor devices, then electrical connectivity is maintained, but warpage occurs
Solution Approach 1:
The patent removes the PCB from the device structure, eliminating the source of warpage while maintaining electrical connectivity through direct solder ball connections and encapsulant-based pathways
Data Source
AI summary
A semiconductor device and manufacturing method thereof. Various aspects of the disclosure may, for example, comprise forming a back end of line layer on a dummy substrate, completing at least a first portion of an assembly, and removing the dummy substrate.