PCD End Milling of Brittle Materials Below the Ductile-Brittle Threshold
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Solution Overview
Problem
Milling brittle materials like glass and sapphire with existing diamond electroplated tools often results in subsurface damage and limited tool life, leading to increased production costs and risk of cracking in mobile phone handset shells.
Innovation Solution
A method using an end milling tool with a superhard material tool head, such as polycrystalline diamond (PCD), where the Undeformed Chip Thickness is controlled to be below the Ductile-Brittle Transition Undeformed Chip Thickness of the material, minimizing subsurface damage and extending tool life by optimizing the tool design and milling parameters.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Productivity
If diamond electroplated tools are used to mill brittle materials, then cutting capability is improved, but subsurface damage increases and tool life decreases
Solution Approach 1:
The patent changes the fundamental material parameter from electroplated diamond to sintered polycrystalline diamond (PCD), which fundamentally alters the tool's mechanical properties. PCD provides superior toughness and resistance to subsurface damage while maintaining high cutting capability, directly resolving the contradiction between productivity and reliability
Solution Approach 2:
The patent uses composite material structure where diamond particles are sintered together to form PCD tool heads. This composite structure combines the hardness of diamond with the toughness of the sintered matrix, enabling both high cutting capability and resistance to subsurface damage and tool chipping
2Productivity
If diamond electroplated tools are used to mill brittle materials, then cutting capability is improved, but tool life decreases
Solution Approach 1:
The patent changes the fundamental material parameter from electroplated diamond to sintered polycrystalline diamond (PCD), which fundamentally alters the tool's mechanical properties. PCD provides superior toughness and resistance to subsurface damage while maintaining high cutting capability, directly resolving the contradiction between productivity and reliability
Solution Approach 2:
The patent uses composite material structure where diamond particles are sintered together to form PCD tool heads. This composite structure combines the hardness of diamond with the toughness of the sintered matrix, enabling both high cutting capability and resistance to subsurface damage and tool chipping
3Speed
If conventional milling parameters are used on brittle materials, then machining speed is maintained, but subsurface damage increases
Solution Approach 1:
The patent identifies and controls the undeformed chip thickness parameter to remain below the ductile-brittle transition threshold. This parameter control enables conventional machining speeds to be maintained while the material removes in a ductile manner, preventing subsurface damage
Solution Approach 2:
The patent establishes preliminary control measures by setting the undeformed chip thickness below the ductile-brittle transition value before machining begins. This pre-established parameter control ensures that the material is always removed in a ductile manner, preventing subsurface damage from occurring in the first place
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This approach significantly reduces subsurface damage and extends tool life, enabling efficient machining of brittle materials while avoiding the limitations of diamond electroplated tools, such as premature wear and environmental impact.
Implementation Method 1
Milling is a cutting process whereby a tool with multiple cutting surfaces is rotated to remove material from the surface of a work piece
Implementation Method 2
By controlling the undeformed chip thickness to be below the DBT value, the material is removed in a ductile manner, preventing subsurface damage
Data Source
AI summary
Herein is provided a method of milling a brittle workpiece (46) using a milling tool (10), •—the workpiece (46) comprising a material, the material having a Ductile-Brittle Transition Undeformed Chip Thickness, DBhrn, •—the milling tool (10) comprising a tool shank (12) having an axis of rotation (14), and further comprising a tool head (16) comprising superhard material at one end thereof, the tool head (16) having a diameter (42), and •—operating the milling tool (10) such that an Undeformed Chip Thickness, hm, of the workpiece (46) is less than said Ductile-Brittle Transition Undeformed Chip Thickness, DBhm of the material.


