PCIe Integrated Connector Module Shielding and Offset Housing
Find Innovative SolutionsGenerate Solutions
Solution Overview
Problem
The challenge is to design an integrated connector module (ICM) that can efficiently accommodate various electronic signal conditioning components and status indicators within a limited footprint, particularly for PCIe applications, while minimizing electromagnetic interference and accommodating high data rate requirements.
Innovation Solution
The ICM design incorporates a plurality of shielding components, including port-to-port, insert-to-insert, and main body shields, along with a unique housing configuration that offsets the signal conditioning portion from the port portion, and features mortise/tenon joints for secure assembly, enabling efficient use of space and effective EMI shielding.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Object-affected harmful factors
If shielding components are added to suppress EMI and crosstalk, then electromagnetic interference suppression is improved, but device complexity increases
Solution Approach 1:
The patent implements multiple shielding components nested within each other: an outer shield surrounding the connector housing, an inner shield within the signal conditioning portion, and partition walls separating individual ports. This nested shielding structure provides comprehensive EMI suppression while efficiently utilizing the limited PCIe footprint space, resolving the contradiction between EMI suppression and device complexity.
Solution Approach 2:
The connector is divided into distinct shielded segments including port-to-port partitions, insert-to-insert shields, and signal conditioning portion shields. This segmentation isolates electromagnetic interference between different functional areas, providing effective EMI suppression without requiring a single complex shielded enclosure, thus reducing overall device complexity.
2Adaptability or versatility
If signal conditioning components are integrated into the connector, then functionality is improved, but available footprint space is reduced
Solution Approach 1:
The patent utilizes the vertical dimension by offsetting the signal conditioning portion from the port portion in the vertical direction rather than horizontally. This three-dimensional arrangement allows signal conditioning components to be integrated within the connector's height, preserving the limited horizontal footprint while maintaining enhanced functionality.
Solution Approach 2:
Signal conditioning components are nested within the connector housing and integrated with the shielding structure. The signal conditioning portion is positioned within the outer shield and surrounded by the inner shield, allowing functional integration without increasing the external footprint dimensions.
3Object-affected harmful factors
If multiple shielding components are used, then Alien Near End Crosstalk suppression is improved, but manufacturing complexity increases
Solution Approach 1:
Multiple shielding components are merged into a unified shielding structure that is integrated with the connector housing. The outer shield, inner shield, and port partitions are designed as interconnected elements that can be manufactured as a single piece or pre-assembled subassembly, reducing manufacturing complexity while maintaining effective crosstalk suppression.
Solution Approach 2:
The shielding components serve multiple functions simultaneously: the outer shield provides EMI suppression, the inner shield protects the signal conditioning portion, and the port partitions provide both mechanical support and crosstalk isolation. This multi-functionality reduces the number of separate components needed, simplifying manufacturing.
Data Source
AI summary
An integrated connector module (ICM) is disclosed. In one embodiment, the ICM includes a plurality of shielding components, the plurality of shielding components comprising a port to port shield, an insert to insert shield and a main body shield. The ICM also contains one or more housing components, the one or more housing components comprising a plurality of ports that are arranged so as to be offset from a main signal conditioning portion of the one or more housing components; and an electronics assembly disposed within the one or more housing components. Methods and apparatus for utilizing and manufacturing the aforementioned ICM are also disclosed.