PCIe SAS Direct Link Connector for Cooler Server SSD Interconnects
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Solution Overview
Problem
Conventional vertical SAS/SATA/PSAS connectors have a complex and over-concentrated structure, leading to high manufacturing costs and poor heat dissipation performance in high-speed data transmission between server SSDs and motherboards.
Innovation Solution
A PCIe SAS direct link connector is introduced, featuring a simplified structure with a cable end and back board, including a direct link female head, high-speed line, and 15pin plug terminal, which replaces the double row configuration, allowing for improved heat dissipation and reduced manufacturing costs by eliminating unnecessary components and optimizing the interconnection.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Device complexity
If a conventional vertical SAS/SATA/PSAS female head with double row configuration is used, then data transmission between server SSD and motherboard can be achieved, but the structure becomes complicated and over-concentrated, leading to high manufacturing cost and poor heat dissipation performance
Solution Approach 1:
The patent divides the conventional double-row vertical connector into two separate single-row connectors (first SAS connector and second SATA connector). Each connector handles a specific function, eliminating the need for a complex integrated structure. This segmentation simplifies the overall connector design while maintaining data transmission functionality between the SSD and motherboard.
Solution Approach 2:
The back board is designed with multi-functional capabilities: it serves as a structural support platform, provides heat dissipation through its hollow area, enables cable fixation, and facilitates electrical connections. This single component performs multiple functions that were previously distributed across several components, reducing overall device complexity and manufacturing cost.
2Temperature
If a conventional vertical SAS/SATA/PSAS female head with double row configuration is used, then data transmission can be achieved, but heat dissipation performance deteriorates due to over-concentrated structure
Solution Approach 1:
By separating the double-row connector into two independent single-row connectors, the patent creates spatial separation between heat-generating components. This segmentation allows heat to dissipate more effectively rather than being concentrated in a single over-dense structure, directly improving thermal management.
Solution Approach 2:
The patent introduces a vertical dimension by using a back board with a large hollow area beneath the connectors. This three-dimensional configuration provides additional space for heat dissipation pathways, moving heat away from the concentrated connector area through the vertical dimension, thereby improving heat dissipation performance.
3Reliability
If wires are used for data transmission from SSD to motherboard, then connectivity is achieved, but data attenuation increases
Solution Approach 1:
The patent extracts and eliminates the intermediate wire component from the data transmission path between the SSD and motherboard. By establishing a direct connection through the back board, the design removes the wires that caused data attenuation, thereby improving signal quality and transmission reliability.
4Ease of manufacture
If a conventional connector design is used, then basic connectivity is achieved, but manufacturing cost increases due to complex structure
Solution Approach 1:
The patent merges the functions of multiple components (connectors, support structure, cable fixation elements) into a single integrated back board. This consolidation reduces the total number of parts that need to be manufactured and assembled, directly lowering manufacturing cost while simplifying the overall structure.
Solution Approach 2:
The back board is designed as a multi-functional component that provides structural support, heat dissipation, cable fixation, and electrical connection pathways. By making this single component perform multiple functions, the patent eliminates the need for several separate components, thereby reducing manufacturing complexity and cost.
Data Source
AI summary
A PCIe SAS direct link connector includes a cable end and a back board; the cable end fixed on the back board and including a direct link female head, a high-speed line, and a 15pin plug terminal; the back board including a primary and a secondary cavity position; the direct link female head connected with the high-speed line; the 15pin plug terminal being an asymmetric bow shape and having a short and a long side, a first contact point disposed on the short side, and a second contact point disposed on the long side; the 15pin plug terminal connected with the high-speed line; when the 15pin plug terminal is combined with a server board end connector, the first contact point and the second contact point contact a terminal of the server board end connector, respectively, simplifying the connection structure and improving heat dissipation.