PCM Cooling Reservoir for Semiconductor Heat Dissipation

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Solution Overview

Problem

Semiconductor devices face challenges in efficiently dissipating heat from hot spots, leading to thermal run-away and reduced electrical performance, particularly in portable electronic equipment where space and thermal management are critical.

Innovation Solution

A cooling device comprising a portable heat reservoir with a phase change material (PCM) is integrated with packaged semiconductor devices, utilizing a reservoir with a cavity between two plates, where the PCM changes phase to absorb and dissipate heat effectively, coupled using a thermal interface material and adapted for die-to-die, wafer-to-wafer, or die-to-PCB packaging configurations.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Temperature

If conventional cooling methods are used for semiconductor devices, then heat dissipation is achieved, but the device size increases and thermal management efficiency decreases

Engineering Contradiction:

Improveheat dissipation efficiencyVSAvoiddevice size

Core Design Contradiction:

TemperatureVSVolume of moving object

Solution Approach 1:

The patent employs phase change material (PCM) that transitions from solid to liquid state to absorb heat from semiconductor devices. The PCM is contained in a reservoir with a wick structure that facilitates heat transfer through phase transition, enabling efficient thermal management in a compact form factor without requiring large conventional cooling systems

Inventive Principle:

Principle #36Phase transitions

Solution Approach 2:

The cooling device is integrated within the semiconductor package structure itself, with the PCM reservoir and wick assembly nested inside the package housing. This nested configuration allows the cooling function to be incorporated without significantly increasing the overall device volume, as the cooling components are housed within the existing package boundaries

Inventive Principle:

Principle #7Nested doll (Nesting)

2Reliability

If portable heat reservoirs with PCM are used, then thermal management efficiency improves, but device complexity increases

Engineering Contradiction:

Improvethermal managementVSAvoidstructure complexity

Core Design Contradiction:

ReliabilityVSDevice complexity

Solution Approach 1:

The patent combines multiple functions into a single integrated cooling assembly: the reservoir housing, PCM containment, wick structure, and thermal interface are merged into one compact unit. This unified design reduces the number of separate components and assembly steps, thereby reducing overall device complexity while maintaining effective thermal management

Inventive Principle:

Principle #5Merging (Combining)

Solution Approach 2:

The phase change material automatically absorbs heat when temperature increases, transitioning from solid to liquid state without requiring external control systems. The wick structure passively facilitates heat transfer through capillary action, eliminating the need for pumps or active cooling mechanisms, thus reducing system complexity while improving thermal management reliability

Inventive Principle:

Principle #25Self-service

3Reliability

If heat dissipation is prioritized, then electrical performance is maintained, but the maximum allowable skin temperature is exceeded in handheld devices

Engineering Contradiction:

Improveelectrical performanceVSAvoidskin temperature

Core Design Contradiction:

ReliabilityVSObject-affected harmful factors

Solution Approach 1:

The patent applies cooling selectively to specific hot spots on the semiconductor die rather than uniformly cooling the entire device. The PCM reservoir is positioned to contact areas of highest thermal generation, providing localized heat absorption that maintains electrical performance while minimizing overall temperature reduction, thus preventing skin temperature exceedance in handheld applications

Inventive Principle:

Principle #3Local quality

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

The solution effectively dissipates heat from semiconductor devices, maintaining the maximum allowable skin temperature in handheld devices, preventing thermal run-away and enhancing electrical performance and reliability, while accommodating various package heights and shapes.

Implementation Method 1

a phase change material (PCM) is integrated with packaged semiconductor devices, utilizing a reservoir with a cavity between two plates, where the PCM changes phase to absorb and dissipate heat effectively

Methodology Applied

Scientific EffectPhase change: Phase Change

Implementation Method 2

the PCM changes phase to absorb and dissipate heat effectively

Methodology Applied

Scientific EffectHeat absorption: Absorption (physical)

Implementation Method 3

coupled using a thermal interface material

Methodology Applied

Scientific EffectThermal conduction: Conduction (thermal)

Data Source

PatentUS11004771B2Cooling devices, packaged semiconductor devices, and methods of packaging semiconductor devices

Publication Date: 2021.05.11 TAIWAN SEMICONDUCTOR MANUFACTURING CO LTD

AI summary

Cooling devices, packaged semiconductor devices, and methods of packaging semiconductor devices are disclosed. In some embodiments, a cooling device for a semiconductor device includes a reservoir having a first plate and a second plate coupled to the first plate. A cavity is between the first plate and the second plate. A phase change material (PCM) is in the cavity. The cooling device is adapted to dissipate heat from a packaged semiconductor device.