Multi-Layer PCM Floor Pavement with Graphene Sub-Layer
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Solution Overview
Problem
Existing outdoor sport surfaces, such as tennis courts made of asphalt or concrete, rapidly overheat during sunny days, and existing phase change material (PCM) solutions have not gained wide market acceptance for effective temperature control.
Innovation Solution
A multi-layer sport surface structure incorporating at least two PCM layers with varying PCM amounts and melting points, combined with a heat conductive sub-layer, utilizing materials like graphite and graphene for improved heat conductivity, operates as a reversible heat pump to manage temperature effectively.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Temperature
If a single PCM layer is used in the floor pavement structure, then the structure is simpler, but the temperature control performance is insufficient
Solution Approach 1:
The single PCM layer is divided into multiple PCM layers with different PCM amounts and melting points. This segmentation allows each layer to activate at different temperature thresholds, providing staged temperature control. The first PCM layer contains a first PCM with a first melting point, while the second PCM layer contains a second PCM with a second melting point, enabling progressive heat absorption as temperature increases.
Solution Approach 2:
Different regions of the pavement structure are given different thermal properties through the multi-layer PCM design. Each PCM layer is positioned at specific depths with specific PCM concentrations tailored to local temperature control needs. The heat conductive sub-layer is strategically placed to direct heat flow to specific PCM layers based on local thermal conditions.
2Temperature
If heat conductive material is added to improve heat transfer, then temperature control effectiveness increases, but the structure becomes more complex
Solution Approach 1:
A heat conductive sub-layer is introduced as an intermediary between the substrate and the PCM layers. This sub-layer contains heat conductive material that facilitates efficient heat transfer from the substrate to the PCM layers, ensuring that thermal energy is effectively delivered to the temperature control mechanism without requiring direct contact between the substrate and PCM.
Solution Approach 2:
The heat conductive sub-layer is formed as a composite material combining a binder with heat conductive material particles. This composite structure provides both mechanical integrity and enhanced thermal conductivity, allowing the sub-layer to serve dual functions as both a structural support and a heat transfer medium.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The structure effectively cools the surface during hot days and prevents overheating, maintaining a desirable temperature range while enhancing shock absorption and surface properties.
Implementation Method 1
a phase change material is mixed into the floor pavement structure to cool the floor pavement structure when exposed to intensive sunshine during a game
Implementation Method 2
The PCM cooling structure operates as a reversible heat pump wherein heat from the ground can be effectively transferred through the heat conductive sub-layer to the top PCM layers
Implementation Method 3
heat from the ground can be effectively transferred through the heat conductive sub-layer to the top PCM layers
Implementation Method 4
The ground serves as a heat sink such that the phase transition is reversed for another usage cycle
Implementation Method 5
the heat conductive material includes graphite, or graphene or a combination thereof for improved heat conductivity between the substrate and the top layer
Data Source
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AI summary
A floor pavement structure exhibiting resistance to overheating, the floor pavement structure comprising at least one layer (101, 102) containing a phase change material. The floor pavement structure may further comprise a heat conductive sub-layer (108) including graphite, graphene or combinations thereof, the heat conductive sub-layer being disposed between the phase change material containing layer and a substrate (110).