PCM Heat Dissipation Structure for Terminal Power Spikes
Find Innovative SolutionsGenerate Solutions
Solution Overview
Problem
Current terminal devices face challenges in effectively dissipating heat during short-time power consumption increases, limiting performance improvement and user experience due to lack of efficient heat dissipation solutions.
Innovation Solution
Incorporation of a phase change material (PCM) with a predetermined phase change point and heat capacity to absorb and store heat from the processor, maintaining the outer surface temperature within a safe range, combined with a heat transfer unit to dissipate heat efficiently.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Productivity
If instantaneous overclocking is used to increase operating power consumption, then performance and program starting time are improved, but heat dissipation requirements increase and outer surface temperature rises excessively
Solution Approach 1:
A phase change material layer is pre-applied to the outer surface of the terminal device housing. When instantaneous overclocking occurs, this pre-positioned phase change material immediately absorbs the generated heat through phase transition, preventing the outer surface temperature from rising excessively during high-performance operations.
Solution Approach 2:
The patent utilizes phase change material that transitions between solid and liquid states to absorb and store heat energy. During instantaneous overclocking, the phase change material absorbs heat from the device interior, maintaining the outer surface temperature within acceptable ranges while enabling sustained high-performance operation.
2Reliability
If conventional heat dissipation methods are used, then steady-state temperature control is achieved, but transient heat dissipation during power consumption spikes is insufficient
Solution Approach 1:
The patent changes the thermal response parameter of the device surface by applying phase change material. This material provides high heat absorption capacity during transient power spikes, enabling the device to maintain reliable heat dissipation throughout the entire duration of instantaneous overclocking operations, not just in steady-state conditions.
Solution Approach 2:
The patent converts the harmful heat generated during instantaneous overclocking into a beneficial phase transition process. The phase change material absorbs the excess heat energy that would otherwise cause overheating, transforming the thermal problem into a controlled phase transition that extends the duration of high-performance operation.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
Effectively manages heat dissipation during high power consumption, preventing overheating and extending the duration of high-performance operation, thereby enhancing user experience.
Implementation Method 1
a phase change material (PCM) with a predetermined phase change point and heat capacity to absorb and store heat from the processor
Implementation Method 2
combined with a heat transfer unit to dissipate heat efficiently
Data Source
Figure 1
Figure 2
Figure 3~4
AI summary
A heat dissipation apparatus applied to a terminal device is provided. The heat dissipation apparatus includes a phase change material (PCM, Phase Change Material) and a heat transfer unit. The heat transfer unit is in contact with the phase change material to conduct heat of the terminal device to the phase change material. Because the phase change material maintains a temperature substantially unchanged during a phase change, a temperature of the heat dissipation apparatus is not excessively high while heat is absorbed, thereby providing good user experience.