Phase-Change Heat Sink Buffering Coolant Failure
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Solution Overview
Problem
Existing heat rejection systems in electronic devices are prone to failure, leading to overheating and potential damage due to the intermittent nature of forced convection methods.
Innovation Solution
A heat sink made from thermally conductive material with internal fluid conduits and cavities containing phase-change material, which stores heat during disruptions in coolant flow and releases it when normal conditions resume, maintaining thermal equilibrium and preventing overheating.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If forced convection systems are used for heat rejection, then heat can be rejected from electronic devices, but the systems are subject to occasional failure leading to overheating
Solution Approach 1:
The patent incorporates phase-change material into the heat sink structure in advance, creating a thermal buffer that activates when coolant flow fails. This beforehand cushioning allows the system to tolerate cooling failures without immediate overheating damage, providing time for recovery or shutdown.
Solution Approach 2:
The patent utilizes phase-change material that transitions between solid and liquid states at specific temperatures. During normal operation, the PCM remains solid and absorbs excess heat. When cooling fails and temperature rises, the PCM melts, absorbing large amounts of latent heat and preventing rapid temperature increase that would cause damage.
2Duration of action of stationary object
If phase-change material is added to heat sink cavities, then heat storage capability is improved during coolant disruptions, but device complexity increases
Solution Approach 1:
The patent merges the phase-change material directly into the heat sink structure by forming cavities within the heat sink body and filling them with PCM. This integration combines the heat dissipation function and heat storage function into a single unified component, avoiding the need for separate heat storage devices and reducing overall system complexity.
Solution Approach 2:
The patent implements a nested structure where phase-change material is contained within cavities that are themselves embedded within the heat sink body. The PCM is nested inside the heat sink structure, allowing the heat storage function to be embedded within the existing heat dissipation system without requiring additional external components.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The solution provides a temporary buffer against overheating by storing heat during coolant disruptions, allowing for safe operation or shutdown of electronic components until normal cooling is restored, effectively extending the operational time and preventing damage.
Implementation Method 1
A phase-change material is contained within each of the internal cavities. The phase-change material is configured to change phase from a solid state to a liquid state at a predetermined heat storage temperature
Implementation Method 2
A heat sink, or cool plate, is formed from a thermally conductive material. Heat from electronic devices or other thermal loads is rejected by way of a fluid coolant flowing through the heat sink
Data Source
AI summary
Methods and means related to rejecting heat through thermal storage are provided. A heat sink includes internal cavities containing a phase-change material. Heat from a thermal load is rejected by flowing fluid coolant at a normal operating temperature. Failure of the fluid coolant system causes heat storage within the phase-change material at a temperature slightly greater than the normal operating temperature. Restoration of the fluid coolant system results in stored heat rejection and a return to a normal operating temperature. Normal operation of the thermal load can be performed while efforts are made to restore the fluid coolant system.