PCM Heat Sink Using Opposed Elements for Passive Heat Dissipation
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Solution Overview
Problem
Conventional heat sinks face challenges in efficiently dissipating heat without accumulating excessive heat, necessitating the development of a design that enhances heat transfer through passive means.
Innovation Solution
A heat sink with opposed thermally conductive elements creating a temperature gradient within a chamber filled with phase change material (PCM), inducing convection currents for enhanced heat absorption and dissipation, where one element is maintained hotter than the other to facilitate natural circulation and effective heat transfer.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Temperature
If conventional heat sinks are used to dissipate heat, then heat transfer occurs through conduction and convection, but heat builds up within the heat sink leading to reduced efficiency and erratic operation
Solution Approach 1:
The patent utilizes phase change material (PCM) that undergoes a phase transition from solid to liquid at a specific temperature, fundamentally changing the thermal parameters of the system. This phase change allows the PCM to absorb large amounts of latent heat while maintaining a relatively constant temperature, thereby improving heat dissipation efficiency without excessive temperature buildup in the heat sink
Solution Approach 2:
The core invention employs phase change material that transitions between solid and liquid phases to enhance heat absorption and dissipation. The PCM absorbs heat from the heat source during phase transition, creating a more effective thermal management system that prevents heat buildup and maintains optimal operating temperatures for electronic components
2Ease of operation
If passive heat sinks are applied directly to heat source components, then heat is transferred by conduction, but heat dissipation efficiency is limited without active cooling devices
Solution Approach 1:
The patent employs phase change material that transitions between solid and liquid phases to enhance heat absorption and dissipation. The PCM absorbs heat from the heat source during phase transition, creating a more effective thermal management system that prevents heat buildup and maintains optimal operating temperatures for electronic components
Solution Approach 2:
The heat sink system operates passively without requiring external power sources or active control mechanisms. The phase change material automatically absorbs and dissipates heat through its inherent phase transition properties, and the thermal conduction through thermally conductive elements occurs naturally based on temperature gradients, eliminating the need for fans or pumps while maintaining high heat dissipation efficiency
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This design maintains the heat sink at a lower temperature than conventional designs, reducing resistance to heat absorption from the source by leveraging the temperature gradient-induced convection currents within the PCM, effectively dissipating heat without the need for active cooling mechanisms.
Implementation Method 1
The PCM receives heat transferred by conduction from the heat source through the thermally conductive base of the PCM chamber
Implementation Method 2
The PCM melts as heat is absorbed
Implementation Method 3
Convection currents are induced in the melting PCM that enhance heat absorption from the heat source
Implementation Method 4
The first thermally conductive element is maintained hotter than the second thermally conductive element to provide a temperature gradient across the PCM chamber
Implementation Method 5
The first thermally conductive element may be trimmed and thermally insulated at the top of the element to prevent dissipation of heat to the ambient air
Implementation Method 6
dissipation of heat through the second thermally conductive element
Implementation Method 7
The upper end of the second thermally conductive element may extend above the top of the PCM chamber and may be exposed to cool air from a cooling fan
Data Source
AI summary
The heat sink with opposed elements providing a temperature gradient has first and second thermally conductive elements disposed diametrically opposite each other on opposite sides of a chamber filled with a thermally conductive phase change material (PCM). The first and second thermally conductive elements ascend vertically from a thermoconductive base of the PCM chamber, which is adapted for mounting on the case of a heat source, such as an electronic component that generates heat or has heat applied thereto from its surroundings during operation. The first thermally conductive element is maintained hotter than the second thermally conductive element to provide a temperature gradient across the PCM chamber. The PCM melts as heat is absorbed. Convection currents are induced in the melting PCM that facilitate heat absorption from the heat source while maintaining the heat sink at a relatively low temperature by dissipation of heat through the second thermally conductive element.