PCM Thermal Control Layer for Transient Chip Heat Spikes
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Solution Overview
Problem
Integrated devices experience fast transient temperature spikes during periods of dormancy, overwhelming existing heat transfer methods and potentially damaging semiconductor devices, leading to efficiency loss and failure.
Innovation Solution
Incorporation of a thermal control layer made of phase-change materials (PCMs) that absorb thermal energy as latent heat during temperature spikes, reducing peak temperature through phase transitions, and releasing heat gradually during dormancy, combined with high thermal conductivity layers for enhanced heat distribution.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Temperature
If conventional heat transfer methods are used, then heat can be dissipated during normal operation, but fast transient temperature spikes during dormancy cannot be effectively controlled
Solution Approach 1:
The patent employs phase-change materials (PCMs) that undergo phase transitions (e.g., solid-liquid or solid-solid) to absorb thermal energy as latent heat during fast transient temperature spikes. This phase transition mechanism provides a passive, rapid response to temperature excursions without requiring external control systems, effectively limiting peak temperatures and protecting semiconductor devices during dormancy periods.
Solution Approach 2:
The invention utilizes materials with temperature-dependent thermal properties, particularly PCMs whose heat capacity and thermal conductivity change dramatically during phase transitions. This parameter change allows the thermal control layer to dynamically adapt its thermal response based on the operating conditions, providing enhanced protection during transient spikes while maintaining normal heat dissipation during steady-state operation.
2Loss of energy
If materials with higher thermal conductivity than silicon dioxide are used, then heat transfer is improved, but control over fast transient temperature spikes is insufficient
Solution Approach 1:
The patent incorporates phase-change materials that provide both high thermal conductivity for efficient heat transfer and latent heat absorption for temperature spike control. The PCMs undergo phase transitions that simultaneously conduct heat away from hot spots and absorb excess thermal energy, achieving both improved heat transfer efficiency and transient temperature control in a single material system.
Solution Approach 2:
The invention uses composite thermal control layers combining phase-change materials with other thermally conductive materials. This composite structure leverages the high thermal conductivity of materials like metals or ceramic composites for heat distribution while the PCM component provides transient temperature control through phase transitions, achieving synergistic performance that neither material could achieve alone.
3Loss of energy
If vias extending through the device are formed, then heat conduction towards outer sidewalls is enhanced, but passive control during dormancy periods is inadequate
Solution Approach 1:
The patent extracts the active control function from the thermal management system by using passive phase-change materials that automatically respond to temperature changes without requiring external control circuits, sensors, or power consumption. This removes the complexity of active thermal management while maintaining effective temperature control during dormancy periods.
Solution Approach 2:
The phase-change materials provide self-regulating thermal control by automatically undergoing phase transitions when temperature spikes occur during dormancy. This self-service mechanism requires no external control systems, sensors, or power sources, eliminating the need for complex active control infrastructure while effectively managing transient temperature conditions.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The PCM thermal control layer effectively mitigates temperature increases during spikes, enhancing semiconductor device longevity and reducing performance degradation by absorbing and releasing heat at controlled rates.
Implementation Method 1
The thermal control layer is configured to reduce an increase in temperature within the integrated circuit by absorbing thermal energy as latent heat around a phase transition temperature of the material
Implementation Method 2
The thermal control layer comprises a phase change material (PCM) and has a large heat capacity relative to other thermally conductive materials and additionally absorbs thermal energy as latent heat (e.g., energy that causes a transition between phases rather than a change in temperature) around a phase transition temperature of the material
Implementation Method 3
A variety of methods of dispersing or transferring the heat away from the circuit components have been developed, including using materials with a higher thermal conductivity than silicon dioxide
Data Source
AI summary
Some embodiments relate to an integrated device, including a substrate having at least one active component; an interconnect structure disposed on the substrate; a bonding layer disposed over the interconnect structure; a carrier substrate disposed over the bonding structure; a heat dissipating module disposed over the carrier substrate; and a first thermal control layer disposed between the carrier substrate and the heat dissipating module, the bonding layer and the interconnect structure, or the carrier substrate and the bonding layer, wherein the first thermal control layer comprises a phase change material (PCM).