PCM-Infused Mesh Heat Spreader for Multi-Chip Package Cooling
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Solution Overview
Problem
Conventional heat spreaders are insufficient for thermal regulation in semiconductor packages that integrate multiple high-power chips, leading to overheating issues, especially in three-dimensional stacked configurations.
Innovation Solution
A heat spreader using a folded metallic mesh infused with phase change material (PCM) such as paraffin, which absorbs heat through phase change and transfers it to a cooler location, improving thermal regulation without the need for active cooling.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Temperature
If conventional heat spreaders are used in semiconductor packages with multiple high-power chips, then the structure is simple and cost-effective, but thermal regulation is insufficient leading to overheating
Solution Approach 1:
The heat spreader uses a composite structure combining metallic mesh (providing thermal conductivity and structural support) with phase change material (absorbing heat through phase transition). This composite approach enables effective thermal management in high-power semiconductor packages while maintaining structural integrity and passive cooling operation.
2Volume of moving object
If more chips are integrated in a single package to achieve compact form factors, then the device size is reduced, but thermal management becomes more challenging
Solution Approach 1:
The heat spreader incorporates phase change material that absorbs heat from multiple high-power chips through phase transition (solid to liquid). This enables compact multi-chip packaging by providing passive thermal management that handles the heat generated by densely integrated chips without requiring active cooling systems.
3Temperature
If phase change material is used for heat absorption, then thermal regulation is improved, but the material has low thermal conductivity
Solution Approach 1:
The heat spreader combines metallic mesh with high thermal conductivity and the phase change material with high latent heat of fusion. The metallic mesh provides efficient heat conduction pathways while the phase change material absorbs thermal energy through phase transition. This composite structure compensates for the low thermal conductivity of the phase change material while maintaining effective heat absorption capability.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This solution enables effective thermal management, allowing for more chips to be integrated in a single package without performance constraints, achieving compact form factors and reducing thermal-induced issues while being a cost-effective and non-corrosive solution.
Implementation Method 1
PCM materials such as paraffin absorb heat energy by changing phase from e.g., a solid phase to a liquid phase
Implementation Method 2
PCM can be used to absorb heat and regulate the temperature of packages that integrate a large number of these types of chips
Implementation Method 3
a three dimensional (3D) metallic mesh network including a PCM improves heat transfer within the assembly
Data Source
AI summary
A semiconductor assembly may include a package substrate. A semiconductor assembly may include a first semiconductor die on the package substrate. A semiconductor assembly may include a first heat spreader heat spreader is attached to the first semiconductor die opposite the package substrate, the heat spreader comprising a mesh infused with phase change material, wherein the heat spreader is configured to dissipate heat from the first semiconductor die.