PCM Microcapsule Plastic Case for Thermal Management

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Solution Overview

Problem

The manufacturing of electronic device cases is complicated, and existing heat dissipation methods, such as using aluminum foils or graphene sheets, are not uniformly applicable to cases of different sizes, leading to undesirable heat dissipation performance.

Innovation Solution

A method involving the mixing of plastic material with phase change material (PCM) microcapsules, which are then formed into a case structure through injection molding, allowing for improved heat absorption and dissipation.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Temperature

If aluminum foils or graphene sheets are attached to the plastic case for heat dissipation, then heat dissipation performance is improved, but manufacturing complexity increases and production cost increases

Engineering Contradiction:

Improveheat dissipation performanceVSAvoidmanufacturing complexity

Core Design Contradiction:

TemperatureVSDevice complexity

Solution Approach 1:

The patent merges the heat dissipation function with the case structure by integrating PCM microcapsules directly into the plastic material during injection molding. This combines two previously separate components (case and heat dissipation layer) into a single integrated structure, eliminating the need for separate attachment processes and reducing manufacturing complexity.

Inventive Principle:

Principle #5Merging (Combining)

Solution Approach 2:

The patent creates a composite material by mixing PCM microcapsules with plastic material before injection molding. This composite approach embeds the heat dissipation functionality within the material itself rather than as a separate layer, achieving both thermal management and structural functions in one material system.

Inventive Principle:

Principle #40Composite materials

2Temperature

If aluminum foils or graphene sheets are used for heat dissipation, then heat dissipation performance is improved, but production cost increases

Engineering Contradiction:

Improveheat dissipation performanceVSAvoidproduction cost

Core Design Contradiction:

TemperatureVSEase of manufacture

Solution Approach 1:

The patent combines the case manufacturing and heat dissipation layer application into a single injection molding process. By integrating PCM microcapsules into the plastic material before molding, the process eliminates separate attachment steps, reducing labor and time costs while maintaining heat dissipation effectiveness.

Inventive Principle:

Principle #5Merging (Combining)

Solution Approach 2:

The patent changes the physical state and form of the heat dissipation material from large sheets (aluminum foils/graphene) to microscopic capsules dispersed in plastic. This parameter change enables the heat dissipation material to be processed along with the plastic in standard injection molding equipment, avoiding the need for specialized attachment processes and reducing overall production cost.

Inventive Principle:

Principle #35Parameter changes

3Temperature

If aluminum foils or graphene sheets are attached to cases, then heat dissipation is improved, but uniformity of heat dissipation across different case sizes deteriorates

Engineering Contradiction:

Improveheat dissipationVSAvoiduniformity across different sizes

Core Design Contradiction:

TemperatureVSAdaptability or versatility

Solution Approach 1:

The patent applies local quality by dispersing PCM microcapsules uniformly throughout the entire plastic case structure. This ensures that heat dissipation capability is distributed evenly across all regions of the case, regardless of the case's overall size or shape, providing consistent thermal performance across different device configurations.

Inventive Principle:

Principle #3Local quality

Solution Approach 2:

The patent creates a universal heat dissipation solution by embedding PCM microcapsules within the plastic material itself. This approach makes the heat dissipation capability intrinsic to the material rather than dependent on external attachments, allowing the same material formulation to be used across cases of different sizes and shapes while maintaining uniform heat dissipation performance.

Inventive Principle:

Principle #6Universality (Multi-functionality)

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

This approach simplifies the manufacturing process and enhances heat dissipation by uniformly dispersing PCM microcapsules within the plastic layer, effectively controlling temperature and maintaining thermal stability without the need for additional machining.

Implementation Method 1

Provide a plurality of phase change material (PCM) microcapsules

Methodology Applied

Scientific EffectPhase change: Phase Change

Implementation Method 2

Mix the plastic material and the plurality of PCM microcapsules so as to form a housing material

Methodology Applied

Scientific EffectLatent heat: Latent Heat

Data Source

PatentUS9799585B2Method for forming a case for an electronic device and manufactured case structure for electronic device

Publication Date: 2017.10.24 INVENTEC PUDONG TECH CORPOARTION

AI summary

A method for forming a case for an electronic device and a manufactured case structure for an electronic device are provided. The method for forming a case for an electronic device comprises the following steps. Provide a plastic material. Provide a plurality of PCM microcapsules. Mix the plastic material and the plurality of PCM microcapsules so as to form a housing material. Form a case from the housing material by injection molding. The manufactured case structure for an electronic device comprises a plastic layer and a plurality of PCM microcapsules. The plurality of PCM microcapsules are dispersed in the plastic layer.