PCM-Filled Porous Interconnects for Fast Thermal Buffering
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Solution Overview
Problem
Existing thermal management solutions for high-power electronic systems face challenges in effectively buffering thermal transients due to the limited responsiveness of phase change materials (PCMs) when deployed remotely from heat sources, and the invasive nature of near-junction deployments which restrict PCM volume and impact steady-state thermal performance.
Innovation Solution
The development of novel thermal buffering electrical interconnects comprising a porous scaffold filled with an electrically conductive phase change material (PCM), which provides both thermal buffering and electrical conductivity, allowing for near-junction deployment without modifying the devices or their substrates.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Device complexity
If PCMs are deployed remotely on a cooling loop, then the system structure is simpler, but the responsiveness to high-frequency thermal transients is reduced
Solution Approach 1:
The patent introduces a porous scaffold as an intermediary structure that enables PCM to be placed in direct contact with the device under test (DUT). The scaffold acts as a mediator between the PCM and DUT, allowing thermal buffering to occur at the junction level without requiring invasive modifications to the device itself. This resolves the contradiction by enabling near-junction deployment through a non-invasive intermediate structure.
Solution Approach 2:
The patent employs a porous scaffold with controlled porosity (e.g., 80-95% void volume) to accommodate the PCM while maintaining structural integrity and electrical conductivity. The porous structure allows the PCM to be in intimate contact with the DUT junction, enabling rapid thermal response. The porosity parameter is optimized to balance thermal buffering capacity with mechanical and electrical performance.
2Speed
If PCMs are placed near the junction, then the responsiveness to thermal transients is enhanced, but the PCM volume is limited by invasive modifications
Solution Approach 1:
The porous scaffold provides a three-dimensional structure with high void volume fraction (80-95%), enabling significantly larger PCM volume to be placed in direct thermal contact with the DUT junction compared to traditional invasive methods. The porous structure accommodates the PCM while maintaining mechanical compliance and electrical conductivity, resolving the limitation on PCM volume.
Solution Approach 2:
The patent creates a composite structure combining the porous scaffold material (e.g., metal foam, ceramic foam, or polymer foam) with the PCM. This composite enables the PCM to be placed in large volumes near the junction while maintaining structural integrity and electrical conductivity. The composite structure eliminates the need for invasive modifications by providing a self-supporting framework.
3Quantity of substance
If PCMs are placed near the junction, then the thermal energy storage capacity increases, but the steady-state thermal performance is degraded due to low PCM thermal conductivity
Solution Approach 1:
The patent creates a composite structure where the porous scaffold material (with higher thermal conductivity than PCM) provides thermal conduction pathways, while the PCM provides thermal energy storage capacity. The composite structure enables both large PCM volume for energy storage and adequate thermal conductivity for steady-state performance. The scaffold acts as a thermal conduit, bypassing the low conductivity limitation of the PCM.
Solution Approach 2:
The patent applies different material properties to different regions of the thermal management system: the porous scaffold provides high thermal conductivity pathways for steady-state heat removal, while the PCM-filled pores provide high thermal energy storage capacity for transient buffering. This spatial differentiation of material functions resolves the contradiction between energy storage and steady-state performance.
4Quantity of substance
If a porous scaffold is used to hold PCM, then the PCM volume is increased, but the electrical conductivity must be maintained
Solution Approach 1:
The patent employs a composite structure where the porous scaffold material (metal foam, ceramic foam, or conductive polymer foam) provides the electrical conduction pathways, while the PCM-filled pores provide thermal energy storage. The scaffold's continuous conductive network maintains electrical conductivity despite the high porosity (80-95%). The composite structure enables both large PCM volume and adequate electrical conductivity.
Solution Approach 2:
The patent assigns different functional roles to different regions: the porous scaffold framework provides electrical conductivity and structural support, while the PCM-filled pores provide thermal energy storage. This spatial separation of functions allows the system to achieve both high PCM volume and maintained electrical conductivity through the scaffold's conductive network.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This solution enhances the responsiveness of PCMs to thermal transients, increases the thermal energy storage capacity, and maintains steady-state thermal performance by integrating the PCM directly with the electronic devices, thus effectively managing high-frequency thermal loading profiles.
Implementation Method 1
a composite electrically connected to the circuit and comprising a porous scaffold having a phase change material (PCM) at least partially filling the porous space of the scaffold
Implementation Method 2
the melting point of the PCM may be selected to be below the maximum safe operating temperature of the circuit
Implementation Method 3
The PCM-filled porous scaffold is electrically conductive
Implementation Method 4
The PCM-filled porous scaffold is electrically conductive
Data Source
AI summary
We disclose novel thermal buffering electrical interconnects. They are formed of an electrical circuit which generates heat; and a composite electrically connected to the circuit and comprising a porous scaffold having a phase change material (PCM) at least partially filling the porous space of the scaffold jointly capable of carrying an electric current. The PCM-filled porous scaffold is electrically conductive.