Phase Change Material Thermal Management for Ventless Data Storage

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Solution Overview

Problem

Portable data storage devices without vent openings face challenges in managing heat due to the absence of natural or forced-air convective cooling, leading to potential overheating during infrequent but intense data transfer operations, which can limit their performance and require larger or heavier designs to maintain component temperatures within operational ranges.

Innovation Solution

Incorporation of a phase change material within a liquid-tight container thermally coupled to the heat source and heat spreader, utilizing the latent heat of fusion to absorb and manage heat energy, thereby maintaining component temperatures within operational ranges without increasing the device's mass or size.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Ease of operation

If a vent-less enclosure is used for portable data storage devices, then the device achieves better sealing and portability, but heat dissipation becomes difficult and component overheating occurs during intense data transfer operations

Engineering Contradiction:

Improveportability and sealingVSAvoidcomponent temperature

Core Design Contradiction:

Ease of operationVSTemperature

Solution Approach 1:

The patent employs phase change material (PCM) that undergoes phase transition from solid to liquid when absorbing heat from the heat source. This phase transition process allows the PCM to absorb large amounts of latent heat at a relatively constant temperature, effectively controlling component temperature rise during intense data transfer operations while maintaining the vent-less sealed enclosure design.

Inventive Principle:

Principle #36Phase transitions

Solution Approach 2:

The patent introduces a phase change material as an intermediary thermal management component between the heat source and the enclosure. The PCM acts as a thermal buffer that absorbs excess heat through phase transition, preventing direct heat transfer to the enclosure structure and maintaining component temperatures within safe operating ranges without requiring ventilation openings.

Inventive Principle:

Principle #24Intermediary (Mediator)

2Temperature

If the device uses larger or heavier designs to manage heat, then component temperatures can be maintained within operational ranges, but the device portability and compactness are reduced

Engineering Contradiction:

Improvecomponent temperature controlVSAvoiddevice weight

Core Design Contradiction:

TemperatureVSWeight of moving object

Solution Approach 1:

The phase change material provides high heat capacity per unit volume through the latent heat of fusion, allowing effective thermal management in a compact form factor. This eliminates the need for large heat sinks or heavy cooling systems, maintaining device portability while effectively controlling component temperatures during intense data transfer operations.

Inventive Principle:

Principle #36Phase transitions

3Temperature

If the device uses larger or heavier designs to manage heat, then component temperatures can be maintained within operational ranges, but the device size increases

Engineering Contradiction:

Improvecomponent temperature controlVSAvoiddevice size

Core Design Contradiction:

TemperatureVSVolume of moving object

Solution Approach 1:

The phase change material absorbs significant amounts of heat through phase transition within a small volume, providing high thermal energy storage density. This allows effective temperature control without requiring large heat sinks or extended cooling structures, maintaining the device in a compact form factor suitable for portable applications.

Inventive Principle:

Principle #36Phase transitions

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

The phase change material effectively controls system temperatures by absorbing heat during data transfers, allowing for smaller, lighter, and less expensive device designs while ensuring key components operate within safe temperature ranges, even during infrequent and intense heat loads.

Implementation Method 1

Incorporation of a phase change material within a liquid-tight container thermally coupled to the heat source and heat spreader, utilizing the latent heat of fusion to absorb and manage heat energy

Methodology Applied

Scientific EffectLatent heat of fusion: Latent Heat

Implementation Method 2

The thermal interface material is coupled to the heat source and to the heat spreader, thereby providing a first low thermal resistance path between the heat source and the heat spreader

Methodology Applied

Scientific EffectThermal conduction: Conduction (thermal)

Data Source

PatentUS10980152B1Thermal rectification with phase change materials

Publication Date: 2021.04.13 SEAGATE TECH LLC

AI summary

A data storage device includes a heat source including a memory, and an enclosure within which the heat source is installed. The data storage device also includes a heat spreader within the enclosure and surrounding the heat source. The data storage device further includes a thermal interface material within the enclosure. The thermal interface material is coupled to the heat source and to the heat spreader, thereby providing a first low thermal resistance path between the heat source and the heat spreader. A phase change material is coupled to the thermal interface material such that the thermal interface material provides a second low thermal resistance path between the heat source and the phase change material.