PCM Thermal Interface in Shield Can Openings for Junction Cooling

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Solution Overview

Problem

Electronic devices face heat dissipation challenges due to the inefficiency of existing thermal interface materials in transferring heat from electronic components to shielding sheets, leading to increased temperatures and potential functional deterioration.

Innovation Solution

Incorporating a phase change material (PCM) into the thermal interface material, which is partially embedded in the shielding sheet, enhances heat transfer by reducing interfacial thermal resistance and improving heat dissipation performance.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Temperature

If conventional thermal interface material is used, then the device structure remains simple, but heat transfer efficiency is insufficient leading to increased junction temperature

Engineering Contradiction:

Improvejunction temperatureVSAvoidheat dissipation performance

Core Design Contradiction:

TemperatureVSReliability

Solution Approach 1:

The thermal interface material is formulated as a composite material incorporating phase change material particles (such as paraffin, salt hydrate, or fatty acid) dispersed within a polymer matrix (such as silicone rubber, epoxy resin, or polyurethane). This composite structure enables the TIM to undergo phase change at specific temperatures, absorbing excess heat through latent heat of fusion and improving heat dissipation performance while maintaining structural integrity and electrical insulation properties.

Inventive Principle:

Principle #40Composite materials

Solution Approach 2:

The phase change material alters the thermal parameters of the interface by changing its physical state (phase) at specific temperatures. During phase transition, the PCM absorbs large amounts of heat without significant temperature increase, effectively reducing junction temperature peaks and improving overall heat transfer efficiency from the electronic component to the heat sink.

Inventive Principle:

Principle #35Parameter changes

2Reliability

If thermal interface material with higher thermal conductivity is used, then heat transfer improves, but interfacial thermal resistance remains a bottleneck

Engineering Contradiction:

Improveheat transfer efficiencyVSAvoidinterfacial thermal resistance

Core Design Contradiction:

ReliabilityVSObject-affected harmful factors

Solution Approach 1:

The phase change material utilizes phase transition (solid-liquid transition) at specific temperatures to absorb latent heat during the melting process. This phase change mechanism effectively bridges the thermal resistance at the interface by providing a large heat absorption capacity during the transition, maintaining efficient heat transfer even when interfacial contact is not perfect, and reducing the impact of interfacial thermal resistance.

Inventive Principle:

Principle #36Phase transitions

3Reliability

If the thermal interface material extends through the opening to improve heat transfer, then heat dissipation performance improves, but the shielding sheet coverage is reduced

Engineering Contradiction:

Improveheat dissipation performanceVSAvoidshielding sheet coverage

Core Design Contradiction:

ReliabilityVSArea of stationary object

Solution Approach 1:

The thermal interface material with phase change properties is applied locally at the heat generation point (electronic component) and extends through the opening in the shielding sheet to the heat sink. This localized application ensures optimal heat transfer at the critical interface while minimizing the impact on overall shielding sheet coverage. The PCM-containing TIM is concentrated where heat transfer is most needed, allowing the shielding sheet to maintain adequate coverage over other areas for electromagnetic interference protection.

Inventive Principle:

Principle #3Local quality

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

The integration of PCM in the thermal interface material effectively reduces the junction temperature of electronic components, improving heat dissipation and extending the lifespan of electronic devices by ensuring efficient heat transfer and radiation.

Implementation Method 1

The thermal interface material may include a phase change material (PCM). The thermal interface material may be at least partially included in the shielding sheet.

Methodology Applied

Scientific EffectPhase change: Phase Change

Implementation Method 2

The thermal interface material may include a phase change material (PCM)

Methodology Applied

Scientific EffectLatent heat: Latent Heat

Implementation Method 3

The thermal interface material may be configured to transfer heat generated from the electronic component to the shielding sheet

Methodology Applied

Scientific EffectThermal conduction: Conduction (thermal)

Data Source

PatentUS20240304565A1Electronic device including thermal interface material having phase change material

Publication Date: 2024.09.12 SAMSUNG ELECTRONICS CO LTD

AI summary

According to an embodiment, an electronic device includes: an electronic component, a shield can including an opening aligned with the electronic component, a shielding sheet disposed on the shield-can, wherein heat generated from the electronic component is configured to be transferred to the shielding sheet, and a thermal interface material (TIM) configured to transfer heat generated from the electronic component to the shielding sheet and extending from the electronic component to the shielding sheet through at least a portion of the opening. The thermal interface material includes a phase change material (PCM), and is included at least partially in the shielding sheet.