Semiconductor PCMTEG Segmentation for Probe Card Measurement Efficiency
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Solution Overview
Problem
The existing semiconductor device measurement process for PCMTEGs is inefficient, requiring long measurement times and prone to inaccurate results due to probe card movement and potential needle defects, which increases workload and risks overlooking quality defects.
Innovation Solution
A semiconductor device with a PCMTEG region divided into a main and sub-PCMTEG region, where TEGs with specifications are collectively arranged in the sub-PCMTEG region, allowing for reduced measurement time and improved productivity by minimizing probe card movement and ensuring accurate contact verification.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Measurement precision
If the probe card is moved to bring needles into contact with multiple PCMTEGs for measurement, then electrical measurements can be performed on different TEGs, but the measurement time increases and productivity decreases
Solution Approach 1:
The PCMTEG region is divided into multiple TEG classification regions, each containing TEGs of the same type. This segmentation allows the probe card to measure all TEGs of a specific type within one region before moving to the next region, reducing the total number of movements required and thereby decreasing measurement time while maintaining measurement capability
Solution Approach 2:
TEGs are pre-arranged in classification regions according to their types before measurement. This preliminary organization enables the probe card to perform measurements in an optimized sequence without requiring complex real-time decision-making about probe card movement, thus reducing measurement time and improving productivity
2Reliability
If the probe card moves extensively to measure all PCMTEGs, then complete electrical characterization is achieved, but the workload and measurement time increase
Solution Approach 1:
By segmenting the PCMTEG region into type-specific classification regions, the patent enables systematic measurement of all TEGs while reducing redundant probe card movements. This ensures complete electrical characterization is achieved without unnecessary time loss
Solution Approach 2:
The structured arrangement of TEGs in classification regions provides a systematic measurement path that reduces the likelihood of measurement errors and enables efficient verification of all TEGs, improving reliability while reducing measurement time
Data Source
AI summary
Provided is a semiconductor device that allows reduction of a measurement time of a PCMTEG and improvement of productivity in an IC manufacturing process. A PCMTEG region 100 formed on a surface of a semiconductor substrate is divided into a main PCMTEG region 101 and a sub-PCMTEG region 102, and TEGs having specifications for their electrical characteristic values are all collectively arranged in the sub-PCMTEG region 102.


