Polycrystalline Diamond Table Substrate Attachment via Catalyst Removal

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Solution Overview

Problem

Existing methods for forming polycrystalline diamond compact (PDC) cutting elements for earth-boring tools often involve complex high temperature/high pressure (HTHP) processes, where catalyst materials are either swept into the diamond grains or mixed with them, making it challenging to attach the diamond table to a substrate effectively and efficiently.

Innovation Solution

A method involving forming a polycrystalline table on a first substrate, removing catalyst material, and then attaching the substrate with the polycrystalline table to another substrate, using techniques like electric discharge machining or grinding to minimize substrate thickness, and optionally leaching catalyst material to enhance attachment and durability.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Ease of manufacture

If catalyst material is swept into diamond grains or mixed with them during HTHP sintering, then polycrystalline diamond table can be formed, but attachment to substrate becomes challenging and complex

Engineering Contradiction:
Improveattachment processVSAvoidHTHP process complexity
Core Design Contradiction:
Ease of manufactureVSDevice complexity

Solution Approach 1:

The catalyst material is removed from the polycrystalline diamond table before attachment to the substrate. This preliminary removal action simplifies the subsequent attachment process by eliminating the complexity of managing catalyst material during and after attachment, while still allowing the diamond table to be formed through HTHP sintering with catalyst.

Inventive Principle:
Principle #10Preliminary action

2Productivity

If substrate thickness is minimized through electric discharge machining or grinding, then attachment efficiency improves, but manufacturing time and complexity increase

Engineering Contradiction:
Improveattachment efficiencyVSAvoidmachining time
Core Design Contradiction:
ProductivityVSLoss of time

Solution Approach 1:

The substrate is machined to a minimized thickness that is sufficient for attachment purposes but not excessively thin. This partial machining approach achieves the necessary attachment efficiency while avoiding the time loss and complexity associated with over-machining or achieving extreme thinness.

Inventive Principle:
Principle #16Partial or excessive action

3Reliability

If catalyst material is leached to enhance attachment, then durability improves, but additional processing steps are required

Engineering Contradiction:
Improveattachment durabilityVSAvoidprocessing steps
Core Design Contradiction:
ReliabilityVSDevice complexity

Solution Approach 1:

Catalyst material is leached out from the polycrystalline diamond table and substrate interface through chemical extraction. This removal of catalyst material enhances the durability of the attachment by eliminating potential weak points or contaminants, while the leaching process itself is integrated into the manufacturing workflow.

Inventive Principle:
Principle #2Taking out (Extraction)

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

This approach allows for a robust and efficient attachment of polycrystalline diamond tables to substrates, improving the durability and performance of cutting elements in earth-boring tools by optimizing the interface between the diamond table and the substrate, thereby enhancing drilling efficiency and tool longevity.

Implementation Method 1

polycrystalline diamond materials are formed by sintering and bonding together relatively small synthetic, natural, or a combination of synthetic and natural diamond grains or crystals, termed 'grit,' under conditions of high temperature and high pressure in the presence of a catalyst

Methodology Applied
Scientific EffectSintering: Sintering

Implementation Method 2

These processes are often referred to as high temperature/high pressure (HTHP) processes

Methodology Applied
Scientific EffectHigh temperature/high pressure (HTHP) process: Hot Isostatic Pressing

Implementation Method 3

cobalt or other catalyst material in the cutting element substrate may be swept into the diamond grains or crystals during sintering and serve as a catalyst material for forming a diamond table from the diamond grains or crystals

Methodology Applied
Scientific EffectCatalysis: Catalysis

Implementation Method 4

using techniques like electric discharge machining or grinding to minimize substrate thickness

Methodology Applied
Scientific EffectElectric discharge machining: Electrical Discharge Machining

Implementation Method 5

using techniques like electric discharge machining or grinding to minimize substrate thickness

Methodology Applied
Scientific EffectAbrasion: Abrasion

Data Source

PatentUS10815732B2Cutting elements, bearings, and earth-boring tools including multiple substrates attached to one another
Publication Date: 2020.10.27 BAKER HUGHES CO
  • US10815732B2 patent drawing
  • US10815732B2 patent drawing
  • US10815732B2 patent drawing

AI summary

Bearings for earth-boring tools may include a first bearing member including a first bearing pad having a first contact surface and a second bearing member including a second bearing pad having a second contact surface in sliding contact with at least a portion of the first contact surface. At least one of the first bearing member and the second bearing member may include a polycrystalline table attached to a portion of a first substrate on which the polycrystalline table was formed. Another substrate may be attached to the portion of the first substrate, the portion of the first substrate interposed between the polycrystalline table and the other substrate. The portion of the first substrate may include a first volume percentage of the first matrix material and the other substrate may include a second, different volume percentage of the second matrix material