PDMS Layer Thermal Radiation in Semiconductor Packages
Find Innovative SolutionsGenerate Solutions
Solution Overview
Problem
Semiconductor packages face challenges in achieving high thermal radiation performance in vacuum states due to weak convective heat transfer, leading to instability and reliability issues, especially in applications like spacecraft and satellites.
Innovation Solution
Incorporating a polydimethylsiloxane (PDMS) layer with high thermal emissivity on semiconductor chips or heat sinks, exposing its upper surface, to enhance thermal radiation efficiency, and using a concavo-convex structure or primer and adhesives for improved attachment and insulation.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Temperature
If conventional heat dissipation methods are used in vacuum state, then the semiconductor chip can operate, but thermal radiation performance is insufficient leading to heat accumulation
Solution Approach 1:
The patent applies parameter changes by selecting PDMS material with specifically optimized thermal emissivity parameters (0.85-0.95) for the polymer layer, and controlling the layer thickness (1-50 μm) to maximize thermal radiation efficiency in vacuum conditions while maintaining operational reliability
Solution Approach 2:
The patent employs composite materials by combining PDMS polymer with high thermal emissivity characteristics, creating a multi-functional layer that simultaneously provides thermal radiation enhancement, electrical insulation, and mechanical protection for the semiconductor chip in vacuum environments
2Temperature
If a PDMS layer is added to improve thermal radiation, then heat emitting performance increases, but device structure becomes more complex
Solution Approach 1:
The PDMS polymer layer is designed to perform multiple functions simultaneously: thermal radiation enhancement, electrical insulation, and mechanical protection. This multi-functionality reduces the need for separate components, thereby simplifying the overall device structure while improving heat emitting performance
Solution Approach 2:
The patent utilizes a thin film approach with PDMS polymer layers ranging from 1 to 50 micrometers in thickness. This thin film structure provides the necessary thermal radiation and insulation functions without adding significant structural complexity or bulk to the semiconductor device
3Temperature
If PDMS layer is used for thermal radiation, then emissivity increases, but manufacturing process becomes more difficult
Solution Approach 1:
The patent optimizes manufacturing parameters by controlling PDMS layer thickness within 1-50 μm and curing temperature between 60-150°C, which simplifies the deposition and bonding processes while achieving the target emissivity range of 0.85-0.95 for effective thermal radiation
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The PDMS layer significantly improves thermal radiation performance by increasing emissivity, providing better heat dissipation, electrical insulation, and durability, thereby enhancing operation stability and reliability in vacuum conditions.
Implementation Method 1
the semiconductor package and the semiconductor apparatus according to the inventive concept include a polydimethylsiloxane (PDMS) layer and may have high heat emitting performance in the vacuum state
Implementation Method 2
a polydimethylsiloxane (PDMS) layer that is provided on the semiconductor chip
Data Source
AI summary
A semiconductor package includes a semiconductor chip and a polydimethylsiloxane (PDMS) layer that is provided on the semiconductor chip and of which upper surface is exposed to the outside. Since the semiconductor package may include the PDMS layer, heat emitting performance of the semiconductor package in a vacuum state may improve.