Chip Packaging PDN Electromagnetic Modeling via Region Segmentation
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Solution Overview
Problem
Current electromagnetic field modeling methods for large-scale power distribution networks in advanced packaging struggle to balance accuracy and speed, requiring significant computational resources and time.
Innovation Solution
The method involves decomposing the power distribution network into sub-regions, using the method of moments (MOM) for electromagnetic field simulation, and connecting sub-magnetic field models to form a complete circuit connection, thereby generating an accurate and efficient large-scale electromagnetic field model.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Measurement precision
If electromagnetic field algorithms are used to model the entire power distribution network, then accuracy is guaranteed, but time and machine resources required for solving increase significantly
Solution Approach 1:
The patent divides the large-scale power distribution network into multiple small sub-regions, each containing hundreds or thousands of via and μbump connections. Each sub-region is modeled independently using electromagnetic field algorithms to generate sub-magnetic field models, which are then combined through circuit connection to form the complete electromagnetic field model. This segmentation approach maintains high-frequency accuracy while reducing computational complexity.
2Productivity
If RLCK circuits are used for equivalent calculation, then processing speed improves, but accuracy at high frequencies cannot be promised
Solution Approach 1:
The patent segments the power distribution network into multiple sub-regions and applies electromagnetic field algorithms to each sub-region rather than using simplified RLCK equivalent circuits for the entire network. This approach preserves high-frequency electromagnetic effects in each local region while enabling parallel processing of multiple sub-regions, thus achieving both accuracy and efficiency.
3Reliability
If the entire power distribution network is modeled as one large bulk, then completeness is achieved, but it is difficult to provide required time and machine resources
Solution Approach 1:
The patent divides the large-scale power distribution network into multiple small sub-regions, each containing hundreds or thousands of via and μbump connections. Each sub-region is modeled independently using electromagnetic field algorithms to generate sub-magnetic field models, which are then combined through circuit connection to form the complete electromagnetic field model. This segmentation approach maintains high-frequency accuracy while reducing computational complexity.
Solution Approach 2:
The patent combines multiple sub-magnetic field models through circuit connection to form a complete electromagnetic field model of the entire power distribution network. The sub-magnetic field models are connected according to the actual physical connections between sub-regions, preserving the overall network topology and electromagnetic characteristics while enabling efficient parallel computation.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This approach reduces computational resources and time significantly, while ensuring high-frequency accuracy, allowing for parallel processing and stable module operation, thus meeting engineering needs.
Implementation Method 1
conducting electromagnetic field solving for each of the at least one decomposed region, and obtaining at least one sub-magnetic field model
Data Source
AI summary
The present invention discloses a chip packaging power distribution network electromagnetic modeling method and system, belongs to the technical field of chip packaging. Targeting at the problem that for electromagnetic field modeling methods of large-scale power distribution networks currently available, it is not possible to promise both accuracy and speed, the present invention provides a chip packaging power distribution network electromagnetic modeling method, comprising: decomposing an initial power distribution network, and obtaining at least one decomposed region; conducting electromagnetic field solving for each of the at least one decomposed region, and obtaining at least one sub-magnetic field model; conducting circuit connection for each of the at least one sub-magnetic field model, and conducting circuit connection for neighboring sub-magnetic field models, and forming a complete circuit connection; and solving the complete circuit connection, and generating a complete electromagnetic field model.