Peach-Shaped Magnetron Scanning Mechanism for Uniform Sputtering
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Solution Overview
Problem
Existing magnetron sputtering technologies face challenges in controlling the movement speed of the magnetron during scanning, leading to uneven utilization of the target material and low metal ionization rates.
Innovation Solution
A magnetron source with a peach-shaped track and dual driving mechanism, allowing independent control of the magnetron's movement speed and trajectory, ensuring comprehensive coverage and optimized scanning of the target material.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Manufacturing precision
If a traditional gear-driven mechanism is used to rotate the magnetron, then the structure is simple and easy to manufacture, but the movement speed cannot be controlled uniformly across different portions of the target material
Solution Approach 1:
The patent transitions from a static gear-driven mechanism to a dynamic servo motor-controlled system. The servo motor enables real-time adjustment of the magnetron's movement speed along the scanning trajectory, allowing uniform scanning speed across different portions of the target material while accommodating the varying radius of the peach-shaped track.
Solution Approach 2:
The patent replaces the traditional mechanical gear transmission system with a servo motor-driven system. This substitution eliminates the complexity of multi-gear mechanisms and enables precise control of the magnetron's movement speed through electronic control, thereby achieving uniform scanning across the target material.
2Manufacturing precision
If the magnetron scans the target material at constant speed, then the scanning is simple, but the utilization ratio of the target material is low especially at center and periphery
Solution Approach 1:
The patent implements a feedback control system where the servo motor receives control signals that adjust the magnetron's movement speed based on its position along the scanning trajectory. This feedback mechanism enables the system to automatically compensate for speed variations and achieve uniform scanning, thereby improving target material utilization without increasing operational difficulty.
Solution Approach 2:
The patent changes the movement speed parameter of the magnetron dynamically during scanning. By adjusting the speed parameter according to the position on the peach-shaped track, the system achieves uniform scanning across the target material, improving utilization ratio while the automated control keeps operation simple.
3Productivity
If a peach-shaped track with dual driving mechanism is used, then the movement speed can be controlled uniformly, but the device complexity increases
Solution Approach 1:
The patent integrates multiple functions into the servo motor-driven scanning mechanism. The same mechanism not only controls the magnetron's movement along the peach-shaped track but also regulates the scanning speed uniformly across different portions of the target material. This multi-functionality improves productivity while minimizing the increase in device complexity.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This solution enhances the utilization ratio of the target material, achieves higher metal ionization rates, and results in an ideal sputtering effect by adjusting scanning times at the periphery and center.
Implementation Method 1
magnetron 2′ is placed on the rear of the target material 10′, and includes magnets 3′ and 4′ with opposite polarities, and generates magnetic field in the portion of the chamber adjacent to the magnets 3′ and 4′
Implementation Method 2
The magnetic field limits electrons so as to limit the motion range thereof, and extends the motion trajectory of the electrons
Implementation Method 3
Magnetron sputtering, which is also called physical vapour deposition, is a method which widely used for depositing metal layers and relevant materials during manufacturing integrated circuits
Data Source
AI summary
Provided is a magnetron source, which comprises a target material, a magnetron located thereabove and a scanning mechanism connected to the magnetron for controlling the movement of the magnetron above the target material. The scanning mechanism comprises a peach-shaped track, with the magnetron movably disposed thereon; a first driving shaft, with the bottom end thereof connected with the origin of the polar coordinates of the peach-shaped track, for driving the peach-shaped track to rotate about the axis of the first driving shaft; a first driver connected to the first driving shaft for driving the first driving shaft to rotate; and a second driver for driving the magnetron to move along the peach-shaped track via a transmission assembly. A magnetron sputtering device including the magnetron and a method for magnetron sputtering using the magnetron sputtering device are also provided.