PEALD Multilayer Sealing Structure for Flexible OLED Barriers

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Solution Overview

Problem

Existing sealing structures for organic light emitting diodes (OLEDs) are either rigid or thick, failing to provide both flexibility and effective moisture and oxygen barrier properties, necessitating a thin, flexible, and efficient sealing solution.

Innovation Solution

A multilayer sealing structure comprising silicon nitride and silicon oxide layers formed through plasma-enhanced atomic layer deposition (PEALD) within a single chamber, with specific plasma and gas purging processes to enhance interfacial stability and moisture permeability.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Reliability

If a conventional sealing structure uses rigid materials like glass or increases thickness to micrometer-scale, then sealing characteristic and moisture barrier property are improved, but flexibility is deteriorated

Engineering Contradiction:
Improvesealing characteristicVSAvoidflexibility
Core Design Contradiction:
ReliabilityVSAdaptability or versatility

Solution Approach 1:

The patent employs thin film structures with thickness of several hundred nanometers instead of rigid glass or thick micrometer-scale layers. The sealing structure uses alternating layers of silicon nitride and silicon oxide deposited by PECVD, creating a flexible yet effective barrier against moisture and oxygen while maintaining the flexibility needed for OLED applications.

Inventive Principle:
Principle #30Flexible shells and thin films

Solution Approach 2:

The patent uses a composite multilayer structure consisting of alternating silicon nitride (SiN) and silicon oxide (SiO) layers. This composite approach combines the low water vapor transmission rate of silicon nitride with the low oxygen permeability of silicon oxide, achieving superior sealing performance while maintaining thin thickness and flexibility.

Inventive Principle:
Principle #40Composite materials

2Adaptability or versatility

If the sealing structure is made thinner to maintain flexibility, then adaptability is improved, but moisture barrier property is deteriorated

Engineering Contradiction:
ImproveflexibilityVSAvoidmoisture barrier property
Core Design Contradiction:
Adaptability or versatilityVSReliability

Solution Approach 1:

The patent employs a composite multilayer structure of silicon nitride and silicon oxide layers. Each layer type contributes its specific barrier property: silicon nitride provides low water vapor transmission rate while silicon oxide provides low oxygen permeability. The alternating layered structure achieves superior combined barrier performance at thin thickness levels, maintaining flexibility while preventing moisture and oxygen penetration.

Inventive Principle:
Principle #40Composite materials

Solution Approach 2:

Instead of relying on single-layer thickness for barrier performance, the patent transitions to a multilayer dimensional structure. The alternating layers of different materials create multiple barrier interfaces, where each interface contributes to the overall barrier property. This dimensional approach allows thin total thickness while maintaining effective moisture and oxygen blocking through the stacked layered architecture.

Inventive Principle:
Principle #17Another dimension (Dimensionality change)

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

The multilayer structure achieves a water vapor transmission rate of 7×10−4 g/m2/day to 5×10−3 g/m2/day, maintaining flexibility while effectively preventing moisture and oxygen permeation, suitable for OLEDs in display devices.

Implementation Method 1

forming a first material layer including a silicon nitride (SiNx) on the substrate; and forming a second material layer including a silicon oxide (SiOx) on the first material layer, wherein the forming of the first material layer and the forming of the second material layer are performed by plasma-enhanced atomic layer deposition (PEALD)

Methodology Applied
Scientific EffectPlasma-enhanced atomic layer deposition: Plasma Enhanced Chemical Vapour Deposition

Data Source

PatentUS12559838B2Sealing structure and manufacturing method therefor
Publication Date: 2026.02.24 INDUSTRY UNIVERSITY COOPERATION FOUNDATION HANYANG UNIVERSITY
  • US12559838B2 patent drawing
  • US12559838B2 patent drawing
  • US12559838B2 patent drawing

AI summary

A method for manufacturing a sealing structure may comprise the steps of: providing a substrate in a chamber; forming a first material layer containing a silicon nitride (SiNx) on the substrate; and forming a second material layer containing a silicon oxide (SiOx) on the first material layer, wherein the step of forming the first material layer and the step of forming the second material layer are performed by a plasma-enhanced atomic layer deposition (PEALD) method.