Plasma Enhanced Atomic Layer Deposition Charge Control
Solution Overview
Problem
The Plasma-Enhanced Atomic Layer Deposition (PEALD) process results in excessive charge on the wafer, which can adversely affect subsequent processing steps in semiconductor device fabrication.
Innovation Solution
The PEALD method reduces wafer charge by selectively performing the plasma treatment process in only a portion of the cycles and extending the post-plasma treatment purge step in others, thereby controlling the charge buildup.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Manufacturing precision
If plasma treatment process is performed in every cycle, then film quality is improved, but excessive charge builds up on the wafer
Solution Approach 1:
The plasma treatment process is applied periodically rather than continuously - specifically once every N cycles where N is an integer between 2-100. This periodic application maintains film quality improvement while allowing charge to dissipate between plasma treatments, preventing excessive charge buildup on the wafer
Solution Approach 2:
Instead of applying plasma treatment in every cycle (excessive action), the process uses partial action by applying it only in 1 out of every N cycles. This reduced frequency is sufficient to maintain film quality while avoiding the harmful effect of excessive charge accumulation
2Manufacturing precision
If plasma treatment process is performed in every cycle, then deposition quality is improved, but productivity is reduced due to extended processing time
Solution Approach 1:
By applying plasma treatment periodically (once every N cycles) rather than in every cycle, the total processing time is reduced by a factor of N, directly improving productivity while maintaining adequate deposition quality through the periodic quality enhancement
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This approach leads to higher quality devices and improved yield by minimizing charge-related issues during subsequent processing steps.
Implementation Method 1
Plasma enhanced atomic layer deposition
Data Source
AI summary
According to one example, a process includes performing a first plurality of layer deposition cycles of a deposition process on a substrate, and after performing the first plurality of layer deposition cycles, performing a plasma enhanced layer deposition cycle comprising a plasma treatment process. The first plurality of layer deposition cycles are performed without a plasma treatment process.