PECVD Aluminum Oxide Thermal Management in PCB Substrates
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Solution Overview
Problem
Legacy substrate architectures for mobile electronic devices face challenges in thermal management due to design rule flexibility limitations, increased costs, and real estate requirements for high thermal conductivity solutions, such as embedded copper chips and thermal vias, which restrict line space scaling and increase costs.
Innovation Solution
The use of Plasma Enhanced Chemical Vapor Deposition (PECVD) aluminum oxide thin film layers as both an adhesion layer between copper and epoxy and a thermal management layer, allowing for greater line space scaling without the need for etching, thus enabling smaller copper trace widths and increased interconnect density while maintaining comparable thermal conductivity.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Temperature
If legacy substrate architectures use embedded copper chips and thermal vias for thermal management, then thermal conductivity is improved, but design rule flexibility is sacrificed and substrate real estate is consumed
Solution Approach 1:
The patent replaces the mechanical/physical approach of using embedded copper chips and thermal vias with a chemical vapor deposition process that forms aluminum oxide layers directly on the substrate. This substitution eliminates the need for additional substrate real estate and maintains design rule flexibility while achieving thermal management goals through controlled material deposition at the molecular level.
Solution Approach 2:
The patent changes the thermal management approach from modifying substrate structure (adding copper elements) to modifying material properties (depositing aluminum oxide layers with specific thicknesses and thermal conductivities). By controlling deposition parameters such as layer thickness and composition, the patent achieves high thermal conductivity without sacrificing design flexibility or consuming additional substrate area.
2Temperature
If copper trace thickness is increased to improve heat capacity, then thermal management is enhanced, but line space scaling is limited
Solution Approach 1:
The patent replaces the approach of increasing copper trace dimensions with a thin-film deposition system that applies aluminum oxide layers. This substitution allows thermal management to be achieved through vertical layering rather than horizontal expansion, thereby maintaining fine line space scaling while providing enhanced heat capacity through the deposited material's thermal properties.
3Temperature
If proprietary build up material with high thermal conductivity is used, then thermal management is improved, but cost increases
Solution Approach 1:
The patent changes from using expensive proprietary build-up materials to using aluminum oxide deposited through chemical vapor deposition. By controlling deposition parameters such as temperature, pressure, and gas flow, the patent achieves high thermal conductivity at lower cost through a more scalable and controllable manufacturing process that eliminates the need for costly proprietary materials.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This approach allows for improved thermal management with minimal impact on substrate design rules, increased electrical performance due to reduced power loss, and enhanced heat dissipation without the need for additional substrate real estate or costly proprietary materials.
Implementation Method 1
Plasma Enhanced Chemical Vapor Deposition (PECVD) aluminum oxide thin film layers
Implementation Method 2
aluminum oxide thin film layers, which may act as a thin film adhesion layer between copper and epoxy, and also as a thermal management layer
Data Source
AI summary
Embodiments herein relate to a package using aluminum oxide as an adhesion and high-thermal conductivity layer with a buildup layer having a first side and a second side opposite the first side, a first trace applied to the first side of the buildup layer, an aluminum oxide layer coupled with the first trace and an exposed area of the first side of the buildup layer, a lamination buildup layer coupled with the aluminum oxide layer on a side of the aluminum oxide layer opposite the buildup layer, wherein the lamination buildup layer includes one or more vias to the trace, and a seed layer coupled with the lamination buildup layer. Other embodiments may be described and/or claimed.