PECVD Diffuser Glue Layer Stress Relaxation
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Solution Overview
Problem
In plasma-enhanced chemical vapor deposition systems, particles are periodically generated and adhered to glass substrates due to increased surface roughness of diffuser throughholes after periodic self-cleaning, leading to defects in manufactured elements and high replacement costs as the diffuser size increases with larger liquid crystal display panels.
Innovation Solution
A diffuser structure with perpendicularly formed throughholes and a glue layer on the side walls of the gas-out parts, where the glue layer's thickness is between 1 μm and 11 μm, is used to reduce shrinkage stress on by-product films, preventing them from peeling off during self-cleaning.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If periodic self-cleaning function is executed to remove by-products, then by-products are cleaned from the PECVD reaction chamber, but surface roughness of throughhole side walls increases leading to particle formation
Solution Approach 1:
A glue layer is formed on the side walls of the throughholes in advance before the chemical vapor deposition process begins. This preliminary coating prevents by-product films from adhering to the side walls during subsequent processing, thereby preventing particle formation without requiring frequent cleaning cycles.
Solution Approach 2:
The glue layer acts as an intermediary substance between the throughhole side walls and the by-product films. It creates a barrier that prevents direct adhesion, allowing the self-cleaning function to effectively remove by-products while maintaining smooth side wall surfaces.
2Productivity
If diffuser is used as upper electrode with throughholes for gas flow, then chemical vapor deposition process can be performed, but by-products are deposited on side walls of throughholes causing particle adhesion to glass substrate
Solution Approach 1:
The glue layer is applied to the throughhole side walls before the deposition process starts, creating a protective barrier that prevents by-products from adhering to the walls and forming particles that could detach and adhere to the glass substrate.
Solution Approach 2:
The glue layer changes the surface properties of the throughhole side walls by altering their chemical and physical characteristics. This modification reduces the surface energy and prevents by-product adhesion, thereby eliminating particle generation while maintaining deposition efficiency.
3Reliability
If periodic self-cleaning function is executed every 6 pieces of glass substrates, then by-products are removed, but particles are formed on one specific glass substrate due to accumulated film stress
Solution Approach 1:
The glue layer is formed in advance on the throughhole side walls to prevent by-product film formation. This eliminates the accumulation of film stress that would otherwise occur during periodic cleaning cycles, preventing particles from forming on any specific glass substrate.
Solution Approach 2:
The glue layer serves as a protective intermediary that prevents direct contact between by-products and the throughhole side walls. This eliminates the film stress accumulation mechanism that causes particles to form on specific substrates during periodic cleaning.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The glue layer stabilizes by-product films, preventing particle formation during self-cleaning and reducing the frequency of diffuser replacement, thus improving manufacturing efficiency and reducing costs.
Implementation Method 1
the glue layer is capable of decreasing shrinkage stress on the surface of each gas-out part when a film is formed by the by-products in the manufacturing process
Data Source
AI summary
A diffuser structure and a manufacturing method thereof are disclosed. The diffuser structure includes a substrate, a plurality of throughholes, and a glue layer. The throughholes are perpendicularly formed in the substrate. Each throughhole includes a gas-in part, a gas-out part, and a connecting part for connecting the gas-in part to the gas-out part. The glue layer is formed on a side wall of each gas-out part, and a thickness of the glue layer is between 1 μm and 11 μm. The present invention can solve a problem that particles are periodically generated after a periodic self-cleaning function is implemented in a plasma-enhanced chemical vapor deposition system.