PECVD Ru Adhesion Layer for High Aspect Ratio Writer Heads

Resolve Bottlenecks,
Find Innovative SolutionsGenerate Solutions

Solution Overview

Problem

The conformality of physical vapor deposited (PVD) seed layers is poor, particularly in high aspect ratio magnetic writer heads with multiple sidewall angles, leading to suboptimal performance and writeability issues in advanced magnetic recording products.

Innovation Solution

The use of plasma-enhanced chemical vapor deposition (PECVD) Ru as an adhesion layer, combined with thermal chemical vapor deposition (TCVD) Ru and PECVD TiN, enhances conformity and adhesion, preventing side gaps and improving surface smoothness and etch resistance in magnetic recording poles.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Manufacturing precision

If PVD technique is used to deposit seed layers, then deposition speed is relatively fast, but conformality is poor especially in high aspect ratio structures

Engineering Contradiction:

ImproveconformalityVSAvoiddeposition speed

Core Design Contradiction:

Manufacturing precisionVSProductivity

Solution Approach 1:

The patent replaces the physical vapor deposition (PVD) mechanical deposition process with plasma-enhanced chemical vapor deposition (PECVD), which uses chemical reactions enabled by plasma to deposit materials. This substitution allows conformal coating in high aspect ratio structures while maintaining reasonable deposition speeds through the reactive chemical process.

Inventive Principle:

Principle #28Mechanics substitution (Replace mechanical system)

Solution Approach 2:

The patent changes the deposition method from PVD to PECVD, fundamentally altering the deposition parameters and mechanism. This parameter change enables the deposition process to achieve superior conformality in high aspect ratio writer trenches while maintaining productivity through optimized plasma processing conditions.

Inventive Principle:

Principle #35Parameter changes

2Reliability

If multiple sidewall angle structure is used to improve writeability, then writeability is improved, but aspect ratio of writer trenches increases leading to poorer conformality

Engineering Contradiction:

ImprovewriteabilityVSAvoidconformality

Core Design Contradiction:

ReliabilityVSManufacturing precision

Solution Approach 1:

The patent replaces PVD with PECVD to overcome the conformality limitations imposed by high aspect ratio trenches. The plasma-enhanced chemical deposition mechanism enables uniform material distribution throughout the deep, narrow trenches created by multiple sidewall angle structures, ensuring consistent seed layer quality despite the challenging geometry.

Inventive Principle:

Principle #28Mechanics substitution (Replace mechanical system)

Solution Approach 2:

The patent applies PECVD Ru as an adhesion layer before the main seed layer deposition. This preliminary action prepares the trench surfaces with a conformal coating that ensures subsequent material deposition achieves the required conformality and adhesion in the high aspect ratio structures.

Inventive Principle:

Principle #10Preliminary action

3Manufacturing precision

If PECVD Ru is used as adhesion layer with TCVD Ru and PECVD TiN, then conformality and adhesion are enhanced, but processing complexity increases

Engineering Contradiction:

ImproveconformalityVSAvoidprocessing complexity

Core Design Contradiction:

Manufacturing precisionVSDevice complexity

Solution Approach 1:

The patent combines PECVD Ru, TCVD Ru, and PECVD TiN in a integrated seed layer structure. By merging these deposition techniques in sequence, the patent achieves superior conformality and adhesion properties that individual layers cannot provide alone, while the combined structure optimizes both performance and manufacturability.

Inventive Principle:

Principle #5Merging (Combining)

Solution Approach 2:

The patent creates a composite seed layer structure using multiple materials (Ru and TiN) deposited by different CVD techniques. This composite approach leverages the complementary properties of each material and deposition method to achieve enhanced conformality, adhesion, and overall seed layer performance.

Inventive Principle:

Principle #40Composite materials

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

This approach results in superior conformity, smooth surfaces, and strong adhesion, enhancing track width control and yield for high aspect ratio magnetic writer heads, while reducing processing time and impurities.

Implementation Method 1

The use of plasma-enhanced chemical vapor deposition (PECVD) Ru as an adhesion layer

Methodology Applied

Scientific EffectPlasma-enhanced chemical vapor deposition: Plasma Enhanced Chemical Vapour Deposition

Implementation Method 2

thermal chemical vapor deposition (TCVD) Ru

Methodology Applied

Scientific EffectThermal chemical vapor deposition: Chemical Vapour Deposition

Data Source

PatentUS8711518B1System and method for deposition in high aspect ratio magnetic writer heads

Publication Date: 2014.04.29 WESTERN DIGITAL TECHNOLOGIES INC

AI summary

Systems and methods for fabricating a microelectric device are provided herein. Various embodiments provide for systems and methods for fabricating a magnetic recording pole using plasma-enhanced chemical vapor deposition (PECVD) when depositing seed material. For some embodiments, fabrication of the magnetic recording pole may comprise using plasma-enhanced chemical vapor deposition (PECVD) Ru as an adhesion layer for a plating seed layer.