Pedestal Temperature Control via Fluid Channel Feedback
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Solution Overview
Problem
Conventional semiconductor processing systems face challenges in maintaining precise temperature control across substrate pedestals due to environmental heat loads, process-induced temperature fluctuations, and inaccuracies from thermocouple measurements, leading to variations in substrate temperature and product quality.
Innovation Solution
A semiconductor processing system with a substrate pedestal that includes a fluid channel for delivering and returning temperature-controlled fluid, coupled with a heater and temperature measurement device for real-time feedback and precise temperature control, allowing for accurate temperature maintenance and rapid adjustments.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Measurement precision
If conventional thermocouple measurement methods are used for temperature monitoring, then the system structure remains simple, but temperature measurement precision deteriorates due to inaccuracies from thermocouple measurements
Solution Approach 1:
The patent introduces a fluid temperature measurement intermediary system. Instead of directly measuring substrate or pedestal temperature with thermocouples, the system measures the temperature of the temperature-controlled fluid circulating through channels in the pedestal. This fluid temperature serves as an indirect but more accurate indicator of the actual thermal conditions, eliminating thermocouple measurement inaccuracies while avoiding direct contact with the substrate.
Solution Approach 2:
The patent replaces the mechanical thermocouple contact measurement system with a fluid-based thermal field measurement system. By measuring fluid temperature through circulation channels rather than direct thermocouple contact with the substrate or pedestal, the system achieves higher measurement precision without the limitations of thermocouple accuracy and direct contact requirements.
2Manufacturing precision
If rapid temperature adjustments are implemented to maintain substrate temperature, then temperature control precision improves, but response time requirements increase system complexity
Solution Approach 1:
The patent implements a closed-loop feedback control system. The fluid temperature measurement device continuously monitors the temperature of the temperature-controlled fluid, and this measurement is fed back to the temperature control device (heater or cooler). The controller automatically adjusts the heating or cooling power based on the measured temperature deviation, maintaining precise substrate temperature control through continuous feedback without requiring overly complex manual intervention systems.
Solution Approach 2:
The patent employs continuous circulation of the temperature-controlled fluid through the pedestal channels, ensuring uninterrupted thermal regulation. The fluid continuously absorbs or dissipates heat from the pedestal and substrate, providing ongoing temperature control action. This continuous thermal management enables rapid response to temperature changes while maintaining manufacturing precision through persistent useful action rather than intermittent adjustments.
3Stability of the object's composition
If environmental heat loads and process-induced temperature fluctuations are addressed through active cooling, then temperature stability improves, but energy consumption increases
Solution Approach 1:
The patent implements a self-regulating temperature control system where the fluid circulation and temperature adjustment occur automatically based on measured temperature conditions. The temperature control device autonomously heats or cools the fluid according to the measured temperature deviation, without requiring external energy-intensive intervention. This self-service approach maintains temperature stability while optimizing energy consumption by activating cooling or heating only when and to the extent necessary.
Solution Approach 2:
The patent dynamically adjusts the temperature parameters of the circulating fluid based on real-time measurements and process conditions. By changing the fluid temperature parameter adaptively rather than maintaining constant aggressive cooling, the system achieves effective temperature stability while reducing unnecessary energy consumption. The fluid temperature is optimized to match the actual thermal requirements of the substrate and process stage.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The system achieves improved temperature uniformity and rapid response to changing conditions, reducing temperature variations to below 3°C and enabling precise control with a response time of less than 5 seconds per degree Celsius, enhancing process consistency and chamber matching.
Implementation Method 1
a heater coupled with the delivery portion of the at least one fluid channel
Implementation Method 2
the cooling device may include a chiller or a heat exchanger
Implementation Method 3
The temperature measurement device may be coupled with the return portion of the at least one fluid channel to directly contact a fluid flowed through the at least one fluid channel
Data Source
AI summary
A semiconductor processing system may include a substrate pedestal. The system may also include at least one fluid channel having a delivery portion configured to deliver a temperature controlled fluid to the substrate pedestal, and having a return portion configured to return the temperature controlled fluid from the substrate pedestal. The system may also include a heater coupled with the delivery portion of the at least one fluid channel. The system may also include a temperature measurement device coupled with the return portion of the at least one fluid channel, and the temperature measurement device may be communicatively coupled with the heater.