Multi-Zone Pedestal Heater Routing Layer for Uniform Wafer Heating
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Solution Overview
Problem
Conventional wafer support pedestals in semiconductor processing chambers have limited heating zones and temperature sensing capabilities due to the presence of electric terminations and resistive heating elements, leading to inefficient heat distribution and monitoring across the wafer support portion.
Innovation Solution
A support pedestal with a resistive layer and a routing layer disposed in different planes, connected by conductive vias, allowing for multiple independently controllable resistive heating elements and eliminating cold spots by extending the resistive layer across the central region, while also using the resistive heating elements as temperature sensors for precise monitoring.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Ease of manufacture
If electric terminations are disposed in the central region of the wafer support portion, then electrical connections are established, but cold spots are generated in the central region
Solution Approach 1:
The patent moves the electric terminations from the central region to the periphery, utilizing the peripheral dimension for electrical connections while preserving the central region for uniform heat distribution. This spatial reorganization eliminates cold spots in the center while maintaining electrical connectivity through peripheral terminations and conductive pathways.
2Temperature
If the central region size is reduced to minimize cold spots, then temperature uniformity improves, but the number of electric terminations and heating zones is limited
Solution Approach 1:
The wafer support portion is divided into multiple independently controllable heating zones with distinct temperature profiles. Each zone can be controlled separately, allowing simultaneous optimization of temperature uniformity in the central region while providing multiple heating zones for different processing requirements.
Solution Approach 2:
Electric terminations are relocated to the periphery, creating additional space in the central region. This enables both multiple heating zones and temperature uniformity to coexist by separating the functional requirements spatially - heating elements distributed across zones while terminations concentrated at the periphery.
3Temperature
If the central region size is reduced, then cold spot area decreases, but the number of temperature sensors that can be disposed is limited
Solution Approach 1:
The central region is expanded to accommodate multiple temperature sensors disposed at different locations. This segmentation of sensing functions across multiple points enables precise temperature monitoring throughout the region while maintaining adequate spacing to avoid measurement interference and ensure accurate spatial temperature profiles.
4Measurement precision
If multiple temperature sensors are disposed in the central region, then temperature monitoring precision improves, but device complexity increases
Solution Approach 1:
Multiple temperature sensors are integrated into a unified monitoring system with centralized signal processing. The sensors share common readout circuitry and control electronics, reducing the overall complexity that would otherwise result from completely independent sensor systems. This merging approach enables precise multi-point temperature monitoring while maintaining manageable device complexity.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
Enables multiple heating zones with precise temperature control and monitoring, reducing the need for additional sensors and improving heat distribution across the wafer support portion, enhancing the efficiency of semiconductor processing.
Implementation Method 1
The wafer support portion may include a resistive heating element for generating heat
Implementation Method 2
The resistive layer and the routing layer are disposed in different planes of the support member and are connected by the plurality of conductive vias
Data Source
AI summary
A support pedestal includes a support member including a resistive layer having a plurality of zones, a routing layer, and a plurality of conductive vias. The plurality of zones are defined by a plurality of independently controllable resistive heating elements. The resistive layer and the routing layer are disposed in different planes of the support member and are connected by the plurality of conductive vias.