Multi-Zone Pedestal Heating for Uniform Substrate Processing
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Solution Overview
Problem
Conventional methods struggle to achieve uniform temperature control and consistent substrate properties across semiconductor processing chambers due to chamber asymmetries and non-linear thermo-chemical processes, leading to defects and variations in substrate quality.
Innovation Solution
A closed-loop substrate control system with a pedestal having multiple heating zones and a controller that adjusts heater power and temperature based on real-time substrate feedback, using a substrate control algorithm to correct and update processing recipes for targeted substrate properties.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Manufacturing precision
If conventional processing methods are used, then chamber asymmetries (temperature, flow, RF fields) cause variations in substrate properties, but implementing uniform control across all substrate regions increases system complexity
Solution Approach 1:
The substrate is divided into multiple discrete regions (e.g., center, edge, intermediate zones) with independently controllable heating elements. Each region can be controlled separately to achieve uniform substrate properties across the entire substrate despite chamber asymmetries, without requiring complex global control of the entire chamber environment.
Solution Approach 2:
Different regions of the substrate are provided with locally optimized heating control based on their specific thermal requirements and position within the chamber. Edge regions may receive different heating power than center regions to compensate for heat loss and chamber asymmetries, achieving uniform substrate properties through localized quality adjustment rather than uniform global control.
2Manufacturing precision
If multiple heating zones with independent control are implemented, then substrate property control is improved, but the number of control parameters and zones increases complexity
Solution Approach 1:
The heating system is designed with heating elements that serve multiple functions: they provide thermal control for their local region, contribute to overall substrate heating, and can be individually modulated for fine-tuned temperature control. This multi-functionality reduces the need for additional dedicated control mechanisms for each zone.
Solution Approach 2:
Adjacent heating zones are merged into functional groups that can be controlled collectively when uniform heating is required, while still allowing individual zone control when local adjustments are needed. This merging approach reduces the effective number of independent control parameters while maintaining the capability for localized control when necessary.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
Significantly reduces processing defects and variations across substrates, enabling rapid adaptation to chamber-to-chamber inconsistencies and achieving precise control of substrate properties with fewer iterations.
Implementation Method 1
each zone including an independent heater... correcting the power or temperature... of one or more heating zones
Implementation Method 2
correcting the power or temperature and/or a heat-exchanger/chiller temperature
Data Source
AI summary
The present technology includes methods and systems for improving substrate processing. Methods and systems include disposing a substrate on a pedestal that includes a plurality of heating zones each with an independent heater, processing the substrate according to an initial substrate processing recipe that includes an initial pedestal temperature, collecting initial substrate feedback of one or more substrate properties and providing the data as a first input to a substrate control algorithm. Methods include generating a substrate model based upon one or more modeling tests of the substrate, providing the generated substrate model as a second input to the substrate control algorithm, controlling the heater power or heater temperature to achieve a targeted substrate property in one or more substrate regions. Methods include where the correction is calculated and performed by a processor running the substrate control algorithm based upon the first input and the second input.