Pedestal Interface Surface for Uniform Thermal Interface Compression

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Solution Overview

Problem

Conventional electronic devices face challenges in effectively dissipating heat from data processing components due to difficulties in properly compressing thermal interface materials, leading to uneven or insufficient compressive forces that hinder efficient heat transfer.

Innovation Solution

The electronic device design incorporates a pedestal with an interface surface featuring varying heights and angles to ensure uniform compression of the thermal interface material, with the substrate and pedestal working together to apply compressive forces that enhance heat transfer from the data processing component to the pedestal.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Temperature

If a thermal interface material is used to bridge the gap between the data processing component and the enclosure, then heat transfer is enabled, but proper compression of the thermal interface material is difficult to achieve

Engineering Contradiction:

Improveheat transfer efficiencyVSAvoidcompression difficulty

Core Design Contradiction:

TemperatureVSEase of operation

Solution Approach 1:

The pedestal interface surface is designed with a first portion having a first height and a second portion having a second height different from the first height, creating localized height variations that apply different compression levels to different regions of the thermal interface material, ensuring uniform compression throughout the material thickness

Inventive Principle:

Principle #3Local quality

Solution Approach 2:

The invention introduces a vertical height dimension variation on the pedestal interface surface, transitioning from a flat two-dimensional surface to a three-dimensional surface with varying heights, which enables the substrate to apply uniform compressive force across the thermal interface material through mechanical leverage

Inventive Principle:

Principle #17Another dimension (Dimensionality change)

2Ease of manufacture

If the interface surface is made planar, then manufacturing is simplified, but uniform compression of the thermal interface material cannot be achieved

Engineering Contradiction:

Improveinterface surface manufacturingVSAvoidcompression uniformity

Core Design Contradiction:

Ease of manufactureVSManufacturing precision

Solution Approach 1:

Inventive Principle:

Principle #3Local quality

Solution Approach 2:

The pedestal interface surface geometry is pre-configured during manufacturing to create the height differential between the first and second portions, which automatically generates the necessary compressive force distribution when the substrate is attached, eliminating the need for post-manufacturing compression adjustment

Inventive Principle:

Principle #10Preliminary action

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

This configuration promotes efficient heat transfer by maintaining uniform compression of the thermal interface material within a desired compression ratio range, thereby improving the device's thermal management capabilities.

Implementation Method 1

heat generated by the data processing component is transferred to the enclosure via the thermal interface material

Methodology Applied

Scientific EffectThermal conduction: Conduction (thermal)

Implementation Method 2

The substrate is fixed to the base such that the data processing component imparts a first compressive force on the thermal interface material and the interface surface imparts a second compressive force on the thermal interface material

Methodology Applied

Scientific EffectCompression: Compression

Data Source

PatentUS11908495B2Electronic device with heat transfer pedestal having optimized interface surface and associated methods

Publication Date: 2024.02.20 WESTERN DIGITAL TECHNOLOGIES INC

AI summary

Disclosed herein is an electronic device that includes a pedestal that extends from a mounting surface of a base of the electronic device. The electronic device also includes a thermal interface material that is interposed between an interface surface of the pedestal and a data processing component, is in direct contact with the data processing component, and is in direct contact with a first portion and a second portion of the interface surface. The first portion of the interface surface of the pedestal has a first height, relative to the mounting surface of the base, and the second portion of the interface surface of the pedestal has a second height, relative to the mounting surface of the base and different than the first height.