Pedestal-Supported Passive Component Embedding for Package Alignment
Find Innovative SolutionsGenerate Solutions
Solution Overview
Problem
The thickness mismatch between the core layer and passive component structure in package substrates leads to issues such as misalignment, rotational shift, and encapsulation thickness variations, particularly when discrete capacitors are used, due to their limited thickness and susceptibility to movement during encapsulation.
Innovation Solution
Incorporating a pedestal made of rigid materials like glass, ceramic, or silicon beneath the passive component structure to provide structural support, ensuring the combined thickness of the pedestal and passive component matches the core layer thickness, thereby stabilizing the component and improving alignment.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Ease of manufacture
If discrete capacitors are used as passive component structures, then the device complexity is reduced and ease of manufacture is improved, but the thickness mismatch between the core layer and passive component structure causes misalignment, rotational shift, and encapsulation thickness variations
Solution Approach 1:
A pedestal structure is introduced as an intermediary component between the core layer and the passive component structure. The pedestal has a first thickness that, when combined with the thickness of the passive component structure, substantially matches the thickness of the core layer. This intermediary structure eliminates the thickness mismatch problem, prevents misalignment and rotational shift during encapsulation, while still allowing the use of discrete capacitors for ease of manufacture.
2Device complexity
If discrete capacitors are used as passive component structures, then the device complexity is reduced, but the passive component structure is prone to shifting or rotation during and after encapsulation due to limited thickness
Solution Approach 1:
The pedestal acts as a stabilizing intermediary platform that supports the passive component structure. By providing a substantial thickness match with the core layer, the pedestal prevents the passive component structure from shifting or rotating during and after encapsulation, thereby improving stability without increasing device complexity.
Solution Approach 2:
The pedestal structure provides beforehand support and cushioning for the passive component structure before encapsulation occurs. This pre-support prevents potential shifting or rotation that would otherwise occur during the encapsulation process or afterward, ensuring stable positioning without requiring complex stabilization mechanisms.
3Reliability
If encapsulation material is placed around the passive component structure, then protection is provided, but thickness variations occur underneath the passive component due to the thickness mismatch
Solution Approach 1:
The pedestal serves as a thickness-matching intermediary that enables uniform encapsulation material thickness. By having its first thickness substantially equal to the difference between the core layer thickness and the passive component structure thickness, the pedestal ensures that encapsulation material can be uniformly applied around the entire assembly without creating thickness variations underneath the passive component, thereby improving both reliability and manufacturing precision.
Data Source
AI summary
An apparatus comprising a package substrate comprising a core layer; a pedestal embedded in the core layer; and a structure comprising a passive circuit component, wherein the structure is above the pedestal and is embedded in the core layer.