Semiconductor Pedestal Sealing Layer for Leak-Safe Flow Paths
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Solution Overview
Problem
The existing semiconductor manufacturing apparatuses face challenges in manufacturing placing pedestals with complex structures due to gaps between members, leading to leaks of heat transfer media and gases, necessitating complicated machining for O-ring placement.
Innovation Solution
A member configuration with a sealing layer having through holes that align with openings in the first and second members, allowing easy assembly and reducing the need for complex machining by using sheet-like sealing layers to prevent leaks.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If complex machining is performed for O-ring placement to prevent leaks, then sealability is improved, but device complexity and manufacturing difficulty increase
Solution Approach 1:
The patent uses a sheet-like sealing layer (thin film) disposed between the first and second members to prevent leaks. This sealing layer has through holes that align with the openings, allowing heat transfer media to pass through while maintaining sealability. This approach replaces complex O-ring placement machining with a simpler sheet-like sealing structure.
Solution Approach 2:
The sealing layer is segmented with multiple through holes corresponding to the openings in the members. This segmentation allows the sealing layer to maintain both sealing function and fluid passage function simultaneously, eliminating the need for complex peripheral sealing structures.
2Reliability
If complex machining is performed for O-ring placement, then leak prevention is improved, but manufacturing time and cost increase
Solution Approach 1:
The sheet-like sealing layer provides leak prevention without requiring complex machining operations. The sealing layer can be simply disposed between the members and aligned with the openings, significantly simplifying the manufacturing process while maintaining effective leak prevention.
Solution Approach 2:
The sealing layer acts as an intermediary element between the first and second members, providing the sealing function without requiring direct complex machining of the members themselves. This intermediary approach simplifies manufacturing by adding a separate component rather than modifying the main structures.
3Ease of operation
If sheet-like sealing layers with through holes are used, then assembly is simplified, but sealability at low temperatures may be compromised
Solution Approach 1:
The sheet-like sealing layer maintains flexibility and sealing capability at low temperatures while allowing simplified assembly. The through holes are precisely aligned with the openings to ensure proper sealing while allowing heat transfer media passage, balancing assembly simplicity with reliable sealability.
Data Source
AI summary
A member used in a semiconductor manufacturing apparatus includes a first member, a second member, and a sealing layer disposed between the first member and the second member. The first member has a plurality of first openings, and the second member has a plurality of second openings respectively corresponding to the plurality of first openings. The sealing layer has a plurality of through holes respectively corresponding to at least two first openings among the plurality of first openings. The at least two first openings respectively communicate with at least two corresponding second openings via the plurality of through holes.