Intermediate-Pedestal Sensor Module for Shared Waterproofing
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Solution Overview
Problem
Waterproofing MEMS microphones and pressure sensors in electronic devices increases complexity, cost, and risk of failure due to the need for separate waterproofing processes for each sensor, which complicates system assembly and increases the form factor.
Innovation Solution
A module design that stacks multiple semiconductor dies along an axis within a single container, using a pedestal to separate compartments and a waterproof cover to facilitate air transfer and reduce the complexity of waterproofing, allowing multiple dies to share a single waterproofing process.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If multiple sensors are waterproofed using separate waterproofing processes, then each sensor achieves waterproof protection, but the system complexity and assembly difficulty increase
Solution Approach 1:
Multiple sensor dies are mounted on a common pedestal structure that forms a single integrated waterproof unit. The pedestal includes integrated sealing features and mounting structures that allow multiple sensors to share common waterproofing infrastructure, eliminating the need for separate waterproofing processes for each sensor.
Solution Approach 2:
The pedestal structure serves multiple functions simultaneously: it provides mechanical support for multiple sensor dies, creates sealed compartments for each sensor, provides integrated sealing surfaces, and enables common waterproofing protection for all sensors. This multi-functional design reduces overall system complexity while maintaining individual sensor protection.
2Reliability
If multiple sensors are waterproofed using separate waterproofing processes, then each sensor achieves waterproof protection, but the manufacturing cost increases
Solution Approach 1:
The pedestal structure enables multiple sensors to be waterproofed as a single integrated unit, reducing manufacturing costs by eliminating redundant waterproofing materials, processes, and quality inspection steps that would be required for separate waterproofing of each sensor.
3Volume of moving object
If sensors are arranged in a stacked configuration along an axis, then the module size is reduced, but the waterproofing complexity increases
Solution Approach 1:
Sensor dies are stacked vertically along an axis within the pedestal structure, with each sensor housed in its own compartment. The pedestal provides integrated sealing structures that accommodate this stacked arrangement, maintaining compact dimensions while simplifying waterproofing through common sealing surfaces and processes.
Solution Approach 2:
The pedestal integrates multiple sealing structures and mounting features into a single component that accommodates the stacked sensor configuration. This merging of functions reduces waterproofing complexity despite the three-dimensional stacking arrangement, as all sensors benefit from the unified pedestal structure.
Data Source
AI summary
A sensor module includes a container. The container has a closed wall extending between a first end of the container and a second end of the container. An exterior of the closed wall at least partly defines a seal-receiving channel. The seal-receiving channel extends around a circumference of the closed wall. The sensor module also includes a pedestal positioned between the first end and the second end and at least partly defining a first compartment and a second compartment surrounded by the closed wall. The sensor module further includes a sensor die positioned within the first compartment and mounted on the pedestal.