Pressure Sensor Stress Isolation Pedestal Design
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Solution Overview
Problem
MEMS pressure sensors are sensitive to mechanical and thermal stress, which can cause shifts in null output, making them unreliable when mounted on plastic substrates or circuit boards.
Innovation Solution
A pedestal is used to isolate the pressure sensor from mechanical stress, with a central column and adhesive bonding to attach the sensor, and a seal between the pedestal and housing to prevent stress transmission from the circuit board.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Device complexity
If the pressure sensor is mounted directly on the circuit board or housing, then the device complexity is reduced, but mechanical and thermal stress is transmitted to the sensor causing output shifts
Solution Approach 1:
A stress isolation pedestal is introduced as an intermediary component between the pressure sensor and the circuit board/housing. This pedestal acts as a mechanical mediator that decouples the sensor from stress sources while maintaining proper mounting and positioning, thereby preventing stress transmission without significantly increasing overall device complexity
Solution Approach 2:
The mounting structure is segmented into distinct functional components: the stress isolation pedestal, the sensor mounting platform, and the housing attachment points. This segmentation allows each component to perform its specific function independently, with the pedestal specifically dedicated to stress isolation while other parts handle mounting and sealing
2Object-affected harmful factors
If the sensor is isolated from the circuit board using a pedestal, then stress transmission is reduced, but the device complexity increases
Solution Approach 1:
The pedestal serves as a specialized intermediary component designed specifically for stress isolation. By concentrating the isolation function in this single component rather than redesigning the entire mounting structure, the increase in device complexity is minimized while effectively reducing mechanical stress on the sensor
Solution Approach 2:
The pedestal is designed with stress-absorbing characteristics that preemptively cushion against mechanical and thermal stress before it reaches the sensor. This beforehand protection is built into the pedestal's structure and material properties, preventing stress transmission without requiring active compensation mechanisms
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The solution effectively minimizes mechanical and thermal stress on the sensor, ensuring reliable output by isolating it from the circuit board and housing structure.
Implementation Method 1
The pressure sensor is attached to the first end of the central column with an adhesive bond
Implementation Method 2
A preferred sealing means is an O-ring seal. An alternative means of sealing is adhesive
Data Source
AI summary
A pressure sensor stress isolation pedestal including a pressure sensor mounted in a housing with a circuit board. The sensor is bonded to a relatively tall pedestal. The height of the pedestal creates a stiff mounting structure that isolates the sensor from mechanical stress. The pedestal is formed by making a recess or moat-like structure around the pressure sensor in the housing that supports the sensor. Preferred sensors are MEMS type Pressure Sensors.