Pedestal-Embedded Substrate Adhesive Flow Control
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Solution Overview
Problem
Component-embedded substrates face issues with connection reliability and insulation reliability due to uneven buildup resin thickness and via diameter variations, leading to bent components and reduced connection areas between electrodes and wirings.
Innovation Solution
Incorporating pedestals around the corners of the component to restrict adhesive material flow, ensuring uniform adhesive thickness and consistent buildup resin thickness, thereby maintaining component flatness and uniform via dimensions.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If adhesive material is applied in semi-cured state and buildup resin is filled into the cavity, then the component is bonded to the conductor layer, but the adhesive material flows outward radially from the corners causing non-uniform adhesive thickness and component bending
Solution Approach 1:
The cavity is formed with predetermined corner regions that restrict adhesive flow before the bonding process is completed. This preliminary structural preparation prevents the adhesive from flowing radially outward from the corners, ensuring uniform adhesive thickness distribution across the component bonding area.
Solution Approach 2:
The cavity structure is designed with differentiated regions: corner regions that restrict adhesive flow and other regions that allow normal bonding. This local differentiation ensures that adhesive thickness is controlled specifically at the corners where radial flow occurs, while maintaining overall bonding effectiveness.
2Strength
If the component is pressed downward by the buildup resin during filling, then the component is secured in position, but the adhesive material is pushed out in all circumferential directions causing non-uniform bonding
Solution Approach 1:
The cavity is pre-formed with corner regions that act as flow restrictors before the component is pressed downward. This preliminary structural arrangement ensures that when the buildup resin pushes the component down, the adhesive is prevented from flowing radially outward from the corners, maintaining component flatness while achieving secure bonding.
3Reliability
If vias are formed in the buildup resin above the component, then electrical connection is established, but the varying resin thickness causes non-uniform via dimensions and reduced connection area
Solution Approach 1:
The cavity structure with restricted corner regions is prepared in advance to ensure uniform adhesive thickness. This preliminary uniformity prevents component bending and ensures that the buildup resin forms a uniform thickness layer above the component, allowing vias to be formed with consistent dimensions and adequate connection areas.
4Reliability
If thermal curing is applied to the buildup resin, then the resin is cured and bonding is completed, but the adhesive material contracts largely causing the bent state to be fostered
Solution Approach 1:
The cavity is pre-formed with corner regions that restrict adhesive flow before thermal curing. This preliminary structural preparation ensures that when the adhesive contracts during thermal curing, it cannot flow radially outward from the corners, preventing the formation of bent states and maintaining component flatness while achieving reliable bonding.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This approach enhances connection reliability by maintaining consistent via dimensions and improves insulation reliability by ensuring a fixed distance between electrodes and wirings, reducing the risk of bent components and uneven resin thickness.
Implementation Method 1
The component is bonded to one of the conductor layers inside the substrate, for example, by an adhesive material or the like
Implementation Method 2
When the buildup resin is thermally cured, the adhesive material in the semi-cured state is simultaneously thermally cured
Implementation Method 3
when, for example, a thermal expansion coefficient of the adhesive material is larger than a thermal expansion coefficient of the component, the adhesive material contracts largely in a cooling process after the thermal curing
Data Source
AI summary
A component-embedded substrate includes: a buildup layer including an insulating resin layer and a conductor layer; a cavity that is formed in the buildup layer; an electronic component that is mounted on a bottom face of the cavity through an adhesive layer; a pedestal that is disposed on the bottom face of the cavity so as to be opposed to four corners of the electronic component; and a filling resin layer that is filled into the cavity to cover the electronic component and the pedestal.