Pedestal Surface for MOSFET Module Thermal Management
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Solution Overview
Problem
Conventional vehicle alternators face increased demands due to modern vehicle requirements, leading to significant heat generation in electrical circuitry that is not efficiently dissipated, limiting their performance and reliability.
Innovation Solution
An electronic package for electric machines is designed with a cooling tower and pedestals that enhance thermal management by distributing power modules in a way that maximizes air flow and conductive cooling, allowing for parallel operation of MOSFET modules and reducing heat loss and electrical noise.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Temperature
If power modules are mounted on a conventional flat surface, then manufacturing is simpler, but heat dissipation efficiency is insufficient
Solution Approach 1:
The mounting surface is segmented into multiple pedestals distributed across the cooling tower surface. Each pedestal provides an independent mounting location for power modules, allowing heat to be dissipated across multiple distributed contact points rather than a single flat surface, thereby improving thermal management efficiency.
Solution Approach 2:
The mounting structure transitions from a two-dimensional flat surface to a three-dimensional pedestal configuration. The pedestals elevate power modules above the cooling tower surface, creating vertical spacing that enhances airflow circulation and thermal conduction pathways, thus improving heat dissipation through additional spatial dimensions.
2Area of stationary object
If power modules are closely arranged to maximize space utilization, then device density increases, but heat dissipation and airflow are compromised
Solution Approach 1:
The cooling tower surface is divided into multiple discrete pedestal locations arranged in a distributed pattern. This segmentation allows power modules to be spaced apart vertically and horizontally, maintaining high area utilization while ensuring adequate airflow channels and thermal conduction paths between modules and the cooling tower.
Solution Approach 2:
By utilizing the vertical dimension through pedestal elevation, the design accommodates multiple power modules in a compact footprint while maintaining optimal spacing for heat dissipation. The vertical offset created by pedestals enables dense horizontal arrangement without compromising thermal performance.
3Temperature
If pedestals are made taller to improve heat dissipation, then cooling efficiency increases, but structural stiffness decreases
Solution Approach 1:
The pedestals are designed with moderate height that provides sufficient thermal conduction and airflow clearance without excessive elevation. This partial action approach achieves adequate cooling efficiency while maintaining structural integrity, avoiding the diminishing returns and structural weakness associated with overly tall pedestals.
Solution Approach 2:
The pedestals are constructed from materials with high thermal conductivity and adequate mechanical strength, creating a composite structure that simultaneously satisfies thermal management requirements and structural stiffness demands. The material selection balances thermal performance with mechanical properties.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The solution effectively reduces heat loss and electrical noise, improves cooling efficiency, and increases the reliability and performance of electric machines by distributing heat sources and optimizing air flow, while also providing structural stiffness to mitigate vibration-related issues.
Implementation Method 1
the power module base and the cooling tower are in conductive thermal communication with each other
Implementation Method 2
enhance the functionality of the electric machine... maximizes air flow and conductive cooling
Data Source
AI summary
An electronic package connectable to an electric machine includes a cooling tower having a metallic wall with a radially outer wall surface. The radially outer wall surface includes discrete, radially outwardly projecting pedestals. The planar pedestal mounting surfaces are parallel with the central axis such that the radial distance between the axis and the radially outer wall surface is greater within the periphery than outside the periphery. Power modules are mounted to the pedestals. Each power module includes a base in thermal contact with a pedestal mounting surface and an opposing interior surface in thermal communication with a MOSFET power electronics device. A cover plate is spaced from the base interior surface. A dielectric housing member surrounds the MOSFET power electronics devices. An electrical connection terminal is disposed outside the periphery of each module. An electric machine including such an electronic package is also disclosed.